18512344. HEAT DISSIPATION APPARATUS AND IN-VEHICLE MODULE simplified abstract (Huawei Technologies Co., Ltd.)
HEAT DISSIPATION APPARATUS AND IN-VEHICLE MODULE
Organization Name
Inventor(s)
HEAT DISSIPATION APPARATUS AND IN-VEHICLE MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18512344 titled 'HEAT DISSIPATION APPARATUS AND IN-VEHICLE MODULE
Simplified Explanation
The patent application describes a heat dissipation apparatus that includes a heat sink housing with upper and lower housings connected in a sealed manner. A primary PCB is fastened to the upper housing, with a primary heat dissipation plate opposite to it. A chip is fastened to a sub PCB, which is electrically connected to the primary PCB using a flexible conductive component. An elastic support component connects the sub PCB to the primary PCB or the primary heat dissipation plate, pressing the sub PCB to allow the chip to be closely attached to the primary heat dissipation plate. A thermally conductive layer is filled between the chip and the upper housing.
- Heat sink housing with upper and lower housings
- Primary PCB fastened to upper housing
- Chip fastened to sub PCB
- Flexible conductive component for electrical connection
- Elastic support component for attachment
- Thermally conductive layer between chip and upper housing
Potential Applications
The technology described in this patent application could be applied in various electronic devices and systems where efficient heat dissipation is crucial, such as computers, servers, LED lighting systems, and automotive electronics.
Problems Solved
1. Improved heat dissipation efficiency 2. Enhanced thermal management in electronic devices 3. Secure attachment of chips for optimal performance
Benefits
1. Increased reliability and longevity of electronic components 2. Prevention of overheating and potential damage 3. Improved overall performance of electronic devices
Potential Commercial Applications
Enhancing Thermal Management in Electronic Devices for Optimal Performance
Original Abstract Submitted
A heat dissipation apparatus is provided, and the apparatus includes: a heat sink housing including an upper housing and a lower housing. The upper and lowers housing are connected in a sealed manner. A primary PCB is fastened to the upper housing, and the primary PCB and the primary heat dissipation plate of the upper housing are disposed opposite to each other. A chip is fastened to a sub PCB. The sub PCB is electrically connected to the primary PCB by using a flexible conductive component. The sub PCB is connected to the primary PCB or the primary heat dissipation plate by using an elastic support component. The elastic support component is configured to press the sub PCB, to enable the chip to be closely attached to the primary heat dissipation plate of the upper housing. A thermally conductive layer is filled between the chip and the upper housing.
