18077570. WIRELESS INTERCONNECT FOR HIGH-RATE DATA TRANSFER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
WIRELESS INTERCONNECT FOR HIGH-RATE DATA TRANSFER
Organization Name
Inventor(s)
Anton Sergeevich Lukyanov of Moscow (RU)
Mikhail Nikolaevich Makurin of Moscow (RU)
WIRELESS INTERCONNECT FOR HIGH-RATE DATA TRANSFER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18077570 titled 'WIRELESS INTERCONNECT FOR HIGH-RATE DATA TRANSFER
Simplified Explanation
The present disclosure is about a wireless data transfer system for high-rate wireless data transfer between different printed circuit boards or between parts of the same printed circuit board. The system aims to improve fabrication, reduce dimensions, minimize losses at high frequencies, and enhance performance.
- The wireless data transfer system consists of two printed circuit boards separated by an air gap.
- A transverse electromagnetic (TEM) mode waveguide is formed between the two circuit boards.
- Each printed circuit board includes a converter structure that performs conversion between the signal transmission line mode and TEM mode in the waveguide.
- The converter structure is connected to an RF component and includes an antenna, a signal transmission line, and at least one reflector.
- The reflector ensures directive propagation of the TEM mode in the waveguide.
- The width of the air gap between the printed circuit boards is limited to not exceed λ/4, where λ is the wavelength of the transmitted signal.
Potential Applications
- High-rate wireless data transfer between different printed circuit boards.
- High-rate wireless data transfer between different parts of the same printed circuit board.
Problems Solved
- Simplifies fabrication of wireless data transfer systems.
- Reduces dimensions of wireless data transfer systems.
- Minimizes losses at high frequencies.
- Improves overall performance of wireless data transfer systems.
Benefits
- Easier fabrication process.
- Smaller dimensions of the wireless data transfer system.
- Lower losses at high frequencies.
- Improved performance of the wireless data transfer system.
Original Abstract Submitted
The present disclosure relates generally to radio engineering, and for example, to high-rate wireless data transfer between different printed circuit boards or between parts of the same printed circuit board. The technical result is easier fabrication, smaller dimensions, lower losses at high frequencies and improved performance. According to the disclosure, a wireless data transfer system comprises: two printed circuit boards separated by an air gap, between which a transverse electromagnetic (TEM) mode waveguide is formed, wherein each printed circuit board includes a converter structure configured to: perform conversion between the signal transmission line mode and TEM mode in the waveguide, connected to an RF component; wherein the converter structure includes: an antenna, a signal transmission line between the antenna and the RF component, and at least one reflector configured to provide directive propagation of the TEM mode in the waveguide; wherein the width of the air gap between the printed circuit boards does not exceed λ/4, where λ is the wavelength of the transmitted signal.
