Meta platforms technologies, llc (20240114630). SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORMABLE SUBSTRATES OF ELECTRONIC DEVICES simplified abstract

SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORMABLE SUBSTRATES OF ELECTRONIC DEVICES

Organization Name

meta platforms technologies, llc

Inventor(s)

Cameron Elliot Glasscock of Redmond WA (US)

Zhenzhen Shen of Kirkland WA (US)

Felippe Jose Pavinatto of Lynnwood WA (US)

Omar Awartani of Redmond WA (US)

Allison Tuuri of Seattle WA (US)

Lichuan Chen of Kirkland WA (US)

Aleksey Reiderman of Erie CO (US)

Marcos Antonio Santana Andrade, Jr. of Seattle WA (US)

SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORMABLE SUBSTRATES OF ELECTRONIC DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240114630 titled 'SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORMABLE SUBSTRATES OF ELECTRONIC DEVICES

Simplified Explanation

The present disclosure describes a system for producing an interconnect in an electronic device, which includes a deformable substrate with a circuit. The circuit has a channel that extends from one portion of the substrate to another, with circuit components adjacent to each portion. Metal materials are formed over the substrate and within the channel to create the interconnect.

• Deformable substrate with a circuit
• Channel extending through the substrate
• Circuit components adjacent to different portions of the substrate
• Metal materials overlaying the substrate and within the channel

Potential Applications

The technology described in this patent application could be used in flexible electronics, wearable devices, and medical implants.

Problems Solved

This technology solves the problem of creating reliable interconnects in deformable substrates, allowing for more flexible and durable electronic devices.

Benefits

The benefits of this technology include improved flexibility, durability, and reliability of electronic devices with deformable substrates.

Potential Commercial Applications

Potential commercial applications of this technology include flexible displays, smart clothing, and medical devices.

Possible Prior Art

One possible prior art for this technology could be the use of flexible printed circuit boards in electronic devices.

Unanswered Questions

1. How does the deformable substrate affect the overall performance of the electronic device? 2. Are there any limitations to the types of circuits that can be implemented using this technology?

Original Abstract Submitted

the present disclosure provides systems, methods, and devices for producing an interconnect. an electronic device of the present disclosure includes a deformable substrate including a circuit. the circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. a first circuit component is adjacent to the first portion of the deformable substrate. a second circuit component is adjacent to the second portion of the deformable substrate. a first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. a second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.