17383241. PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD simplified abstract (QUALCOMM Incorporated)

From WikiPatents
Jump to navigation Jump to search

PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD

Organization Name

QUALCOMM Incorporated

Inventor(s)

Anirudh Bhat of San Diego CA (US)

Jay Scott Salmon of San Diego CA (US)

PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD - A simplified explanation of the abstract

This abstract first appeared for US patent application 17383241 titled 'PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD

Simplified Explanation

The abstract of this patent application describes a package that consists of a substrate, a first integrated device, a first block device, and a second encapsulation layer. The first block device includes a first electrical component, a second electrical component, a first encapsulation layer, and a first metal layer.

  • The package includes a substrate, which serves as a base for the other components.
  • The first integrated device is connected to the substrate and is part of the package.
  • The first block device is also connected to the substrate and is part of the package.
  • The second encapsulation layer encapsulates both the first integrated device and the first block device, providing protection and insulation.
  • The first block device includes a first electrical component and a second electrical component, which are both enclosed by a first encapsulation layer.
  • The first metal layer is coupled to the first encapsulation layer, possibly providing additional functionality or connectivity.

Potential applications of this technology:

  • This package design could be used in various electronic devices, such as smartphones, tablets, or computers.
  • It could also be applied in automotive electronics, medical devices, or industrial equipment.

Problems solved by this technology:

  • The package design provides protection and insulation for the integrated and block devices, preventing damage from external factors.
  • It allows for the integration of multiple electrical components within a single package, reducing the overall size and complexity of the device.

Benefits of this technology:

  • The encapsulation layers provide improved reliability and durability for the electrical components.
  • The compact design saves space and allows for more efficient use of the device.
  • The integration of multiple components within a single package simplifies the manufacturing process and reduces costs.


Original Abstract Submitted

A package that includes a substrate, a first integrated device coupled to the substrate, a first block device coupled to the substrate, a second encapsulation layer encapsulating the first integrated device and the first block device. The first block device includes a first electrical component, a second electrical component, a first encapsulation layer at least partially encapsulating the first electrical component and the second electrical component, and a first metal layer coupled to the first encapsulation layer.

Retrieved from "http://wikipatents.org/index.php?title=17383241._PACKAGE_COMPRISING_A_BLOCK_DEVICE_WITH_A_SHIELD_simplified_abstract_(QUALCOMM_Incorporated)&oldid=19424"