17986242. ELECTRONIC DEVICE INCLUDING SHEILDING STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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ELECTRONIC DEVICE INCLUDING SHEILDING STRUCTURE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Haejin Lee of Suwon-si (KR)

Min Park of Suwon-si (KR)

Kyuhwan Lee of Suwon-si (KR)

ELECTRONIC DEVICE INCLUDING SHEILDING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17986242 titled 'ELECTRONIC DEVICE INCLUDING SHEILDING STRUCTURE

Simplified Explanation

The patent application describes an electronic device with a circuit board and a shield can that surrounds a component on the board. The shield can has an opening, which is covered by a nanofiber film.

  • The nanofiber film consists of three layers, arranged sequentially in one direction.
  • The first and third layers have a lower electrical resistance value than the second layer, but in a different direction.
  • The second layer has a lower electrical resistance value than the first and third layers in the first direction.

Potential Applications:

  • This technology can be applied in various electronic devices such as smartphones, tablets, laptops, and other portable devices.
  • It can be used in electronic components that require shielding from external interference or electromagnetic radiation.

Problems Solved:

  • The nanofiber film provides an effective shield against external interference or electromagnetic radiation, protecting the component on the circuit board.
  • The layered structure with varying electrical resistance values helps in controlling the flow of electrical current in different directions.

Benefits:

  • The nanofiber film's ability to shield against external interference ensures the proper functioning of the electronic device.
  • The layered structure with different electrical resistance values allows for better control and management of electrical currents within the device.


Original Abstract Submitted

The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.