18389923. HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
Contents
- 1 HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD
Organization Name
Inventor(s)
Xiaoyuan Ying of Shanghai (CN)
HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18389923 titled 'HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD
Simplified Explanation
The patent application describes a heat dissipation apparatus that includes a support mounted to a circuit board, a heat sink attached to the support, and an elastic component providing pressure to tightly attach the heat sink to a heat source on the circuit board.
- Support mounted to a circuit board
- Heat sink attached to the support
- Elastic component providing pressure to attach the heat sink to the heat source
- Peak-valley structure in the elastic component for force application
- Assembly opening on the support for accommodating the heat source
Potential Applications
The technology can be applied in electronic devices such as computers, servers, and other devices with heat-generating components that require efficient heat dissipation.
Problems Solved
The technology solves the problem of heat buildup in electronic devices, which can lead to performance degradation and component damage if not properly dissipated.
Benefits
- Improved heat dissipation efficiency - Enhanced performance and reliability of electronic devices - Compact design for space-constrained applications
Potential Commercial Applications
"Efficient Heat Dissipation Technology for Electronic Devices" can be used in the manufacturing of computer servers, gaming consoles, and high-performance computing systems.
Possible Prior Art
Prior art may include traditional heat sink designs with simple mounting mechanisms that may not provide optimal pressure for efficient heat transfer.
Unanswered Questions
How does this technology compare to existing heat dissipation solutions on the market?
The article does not provide a direct comparison with existing heat dissipation solutions, making it difficult to assess the technology's competitive advantage.
What are the potential limitations or drawbacks of this heat dissipation apparatus?
The article does not mention any potential limitations or drawbacks of the technology, leaving room for further investigation into its practical implementation and performance in real-world scenarios.
Original Abstract Submitted
A heat dissipation apparatus is disclosed. In the dissipation apparatus, a support is mounted to a circuit board, and an assembly opening on a bearing portion in the support is configured to accommodate a heat source on the circuit board. A heat sink is disposed on the bearing portion of the support, and a heat conducting surface of the heat sink can penetrate the assembly opening, to be attached to the heat conducting surface of the heat source. A peak-valley structure in an elastic component is disposed on a mounting surface of the heat sink as a force-applying portion, and two ends of the elastic component exceed an edge of the heat sink and are mounted to the support as mounting portions. At least one elastic component can provide, to the heat sink by using the peak-valley structure, pressure to tightly attach the heat sink to the heat source.
