Huawei technologies co., ltd. (20240107656). CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE simplified abstract
Contents
- 1 CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
Organization Name
Inventor(s)
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240107656 titled 'CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
Simplified Explanation
The circuit board assembly described in the patent application resolves a heat dissipation problem by combining low-speed signals transmitted between I/O modules and an IC chip on a second circuit board, and then transmitting the combined signals to the IC chip using a low-speed cable. The assembly extends a low-speed signal sent by the IC chip to the I/O modules into multiple low-speed signals on the second circuit board, which are then separately sent to the I/O modules.
- The circuit board assembly combines low-speed signals between I/O modules and an IC chip on a second circuit board.
- The combined signals are transmitted to the IC chip using a low-speed cable.
- The assembly extends a low-speed signal from the IC chip into multiple low-speed signals on the second circuit board.
- The multiple low-speed signals are separately sent to the I/O modules.
Potential Applications
The technology can be applied in scenarios where a large quantity of electronic components need to be disposed on a circuit board.
Problems Solved
1. Heat dissipation issues on a circuit board. 2. Efficient transmission of low-speed signals between I/O modules and an IC chip.
Benefits
1. Improved heat dissipation. 2. Enhanced signal transmission efficiency. 3. Increased reliability of electronic communications technologies.
Potential Commercial Applications
Optimizing heat dissipation in electronic devices.
Prior Art
No prior art information is provided.
Unanswered Questions
How does the circuit board assembly compare to existing solutions in terms of cost-effectiveness?
The cost-effectiveness of the circuit board assembly compared to existing solutions is not addressed in the abstract. It would be beneficial to understand how the assembly's implementation impacts overall costs.
What are the potential challenges in integrating the circuit board assembly into existing electronic communication systems?
The abstract does not mention any challenges related to integrating the circuit board assembly into existing systems. Identifying potential integration challenges can help in assessing the feasibility of adopting this technology.
Original Abstract Submitted
a circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. the circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of i/o modules and an ic chip, and then transmits the combined low-speed signals to the ic chip by using a low-speed cable. a low-speed signal sent by the ic chip to the plurality of i/o modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of i/o modules. this may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.
