20240049388. SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS simplified abstract (DexCom, Inc.)
Contents
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
Organization Name
Inventor(s)
Sean Frick of San Francisco CA (US)
Louis Jung of Foster City CA (US)
David Lari of San Francisco CA (US)
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240049388 titled 'SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
Simplified Explanation
The abstract describes a sensor interposer that uses castellated through-vias formed in a PCB. It includes a planar substrate with multiple castellated through-vias. The interposer has a first electrical contact connected to a first castellated through-via and a second electrical contact connected to a second castellated through-via, which is electrically isolated from the first one. Additionally, a guard trace is formed on the substrate, with a first portion on one surface of the substrate connecting a third and fourth castellated through-via, and a second portion on the other surface connecting the same third and fourth castellated through-via. The guard trace is positioned between the first and second electrical contacts to provide electrical isolation between them.
- The sensor interposer employs castellated through-vias in a PCB.
- It includes multiple castellated through-vias on a planar substrate.
- The interposer has separate electrical contacts for different castellated through-vias.
- A guard trace is formed on the substrate to provide electrical isolation between the contacts.
- The guard trace connects specific castellated through-vias on both surfaces of the substrate.
Potential applications of this technology:
- Sensor integration: The interposer can be used to connect and integrate sensors into electronic systems.
- PCB design: The castellated through-vias provide a compact and efficient solution for connecting different components on a PCB.
- High-speed communication: The interposer can be used in high-speed communication systems to ensure proper signal integrity and isolation.
Problems solved by this technology:
- Electrical isolation: The guard trace between the electrical contacts provides electrical isolation, preventing interference and cross-talk.
- Compact design: The use of castellated through-vias allows for a more compact and space-efficient design compared to traditional through-holes.
- Signal integrity: The interposer helps maintain signal integrity by minimizing signal loss and noise.
Benefits of this technology:
- Improved performance: The electrical isolation and signal integrity provided by the interposer contribute to improved overall system performance.
- Space-saving: The compact design of the interposer allows for more efficient use of space on a PCB.
- Cost-effective: The use of castellated through-vias and the simplified design of the interposer can lead to cost savings in manufacturing and assembly processes.
Original Abstract Submitted
an example sensor interposer employing castellated through-vias formed in a pcb includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.
