20240015881. PRINTED CIRCUIT BOARD (PCB) COOLING simplified abstract (Raytheon Technologies Corporation)

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PRINTED CIRCUIT BOARD (PCB) COOLING

Organization Name

Raytheon Technologies Corporation

Inventor(s)

Yongduk Lee of Vernon CT (US)

Parag M. Kshirsagar of South Windsor CT (US)

Ankit Gupta of Willimantic CT (US)

PRINTED CIRCUIT BOARD (PCB) COOLING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240015881 titled 'PRINTED CIRCUIT BOARD (PCB) COOLING

Simplified Explanation

The abstract of this patent application describes a printed circuit board (PCB) assembly that includes two PCBs, with one mounted on top of the other. The second PCB has a cooling path inside it, which allows coolant to flow from an inlet end to an outlet end. The first PCB has power pillars that extend across the cooling path.

  • The patent application describes a PCB assembly with a cooling system.
  • The assembly consists of two PCBs, with one mounted on top of the other.
  • The second PCB has a cooling path inside it, allowing coolant to flow through it.
  • The first PCB has power pillars that extend across the cooling path.

Potential Applications:

  • This technology can be used in electronic devices that generate a significant amount of heat, such as computers, servers, or power electronics.
  • It can also be applied in automotive electronics, where heat dissipation is crucial for the proper functioning of various components.

Problems Solved:

  • The PCB assembly addresses the issue of heat generation in electronic devices by providing a cooling path to dissipate the heat efficiently.
  • The power pillars help in transferring heat from the first PCB to the cooling path, preventing overheating and potential damage to the components.

Benefits:

  • The cooling system improves the overall performance and reliability of the electronic device by maintaining optimal operating temperatures.
  • It allows for the use of heat-generating components without the risk of overheating, extending their lifespan.
  • The design of the PCB assembly provides a compact and efficient solution for heat dissipation, saving space and reducing the need for additional cooling mechanisms.


Original Abstract Submitted

a printed circuit board (pcb) assembly includes a first pcb including at least one heat generating component. a second pcb is mounted to the first pcb. the second pcb defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path. a plurality of power pillars extend from the first pcb and across the cooling path.

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