18336096. FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Youngbae Kim of Suwon-si (KR)

FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18336096 titled 'FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME

Simplified Explanation

The abstract describes a film package that includes a film substrate with a device region and a reinforcing region. The package also includes a semiconductor chip with interconnection patterns and a protective layer.

  • The film package includes a film substrate with a device region and a reinforcing region.
  • The film substrate extends in a first direction and has a first side and a second side facing each other.
  • The device region is located between the first side and the second side of the film substrate.
  • The reinforcing region is adjacent to at least one side of the device region in a second direction that intersects the first direction.
  • The semiconductor chip has an elongated rod shape and is placed on the device region of the film substrate in the first direction.
  • The interconnection patterns are electrically connected to the semiconductor chip and include input patterns extending toward the first side and output patterns extending toward the second side of the film substrate.
  • The film substrate has a protective layer that covers at least a portion of the interconnection patterns.

Potential applications of this technology:

  • Packaging and protection of semiconductor chips in electronic devices.
  • Integration of interconnection patterns for electrical connections in film packages.

Problems solved by this technology:

  • Provides a reinforced film substrate to support and protect the semiconductor chip.
  • Allows for efficient electrical connections between the semiconductor chip and external devices through the interconnection patterns.

Benefits of this technology:

  • Enhanced durability and reliability of the film package due to the reinforcing region.
  • Simplified manufacturing process for film packages with integrated interconnection patterns.
  • Improved electrical performance and signal transmission through the interconnection patterns.


Original Abstract Submitted

A film package includes a film substrate extending in a first direction and including a first side and a second side facing each other, the film substrate including a device region between the first side and the second side, and the film substrate including a reinforcing region adjacent to at least one side of the device region in a second direction, the second direction intersecting the first direction. The film package includes a semiconductor chip having an elongated rod shape, and the semiconductor chip on the device region of the film substrate in the first direction, interconnection patterns electrically connected to the semiconductor chip, the interconnection patterns comprising input patterns extending toward the first side on the film substrate, and output patterns extending toward the second side on the film substrate, and a protective layer on the film substrate to cover at least a portion of the interconnection patterns.

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