18520642. CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE simplified abstract (AGC Inc.)
Contents
- 1 CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE
Organization Name
Inventor(s)
Nobuo Inuzuka of Shizuoka (JP)
Hirofumi Yamamoto of Shizuoka (JP)
CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18520642 titled 'CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE
Simplified Explanation
The present invention is a circuit board for a high-frequency device, made of a glass substrate with a low dielectric loss tangent, suitable for high-frequency applications.
- Glass substrate with a crystal precipitated and cuttable by etching
- Dielectric loss tangent at 20°C and 10 GHz of 0.0090 or less
- Suitable for high-frequency devices
Potential Applications
The technology can be used in:
- High-frequency communication devices
- Radar systems
- Satellite communication systems
Problems Solved
- High dielectric loss in traditional circuit boards
- Limitations in high-frequency applications due to dielectric losses
Benefits
- Improved performance in high-frequency devices
- Enhanced signal transmission efficiency
- Increased reliability in high-frequency applications
Potential Commercial Applications
- Telecommunications industry
- Aerospace and defense sector
- Electronics manufacturing companies
Possible Prior Art
There may be existing circuit boards for high-frequency devices, but the specific combination of a glass substrate with a low dielectric loss tangent as described in this invention may be novel.
Unanswered Questions
How does this technology compare to existing high-frequency circuit boards in terms of cost-effectiveness?
The article does not provide information on the cost implications of implementing this technology compared to traditional high-frequency circuit boards.
What are the environmental impacts of using glass substrates in high-frequency devices?
The article does not address the potential environmental considerations of using glass substrates in high-frequency devices, such as recycling or disposal methods.
Original Abstract Submitted
The present invention relates to a circuit board for a high-frequency device, including: a glass substrate in which a crystal is precipitated and cuttable by etching, and which has a dielectric loss tangent at 20° C. and 10 GHz of 0.0090 or less, and relates to a high-frequency device including the circuit board.
