18387351. FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME
Organization Name
Inventor(s)
Younghun Seong of Suwon-si (KR)
Jeongnam Cheon of Suwon-si (KR)
FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18387351 titled 'FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME
Simplified Explanation
The patent application describes a flexible circuit board and a foldable electronic device with a highly bendable region between two multi-layer regions.
- Structure includes stacked copper clad laminates (CCLs) in the first and second multi-layer regions.
- Highly bendable region has a single CCL stacked from one CCL in the first and second multi-layer regions.
- Single CCL configured for transmitting a single RF signal with ground wires and sub wires.
Potential Applications:
- Foldable smartphones and tablets
- Wearable technology
- Flexible displays
Problems Solved:
- Increased durability of foldable electronic devices
- Improved flexibility in design and form factor
- Enhanced signal transmission in bendable devices
Benefits:
- Greater versatility in electronic device design
- Longer lifespan for foldable devices
- Improved signal quality in flexible electronics
Original Abstract Submitted
A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.
