17947397. MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)

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MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO.,LTD.

Inventor(s)

Wonseop Lee of Daegu (KR)

Hwanwook Park of Seoul (KR)

Jeonghoon Baek of Hwaseongi-si (KR)

Dohyung Kim of Seoul (KR)

Seunghee Mun of Yongin-si (KR)

Dongyoon Seo of Seoul (KR)

Jinoh Ahn of Gwacheon-si (KR)

MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17947397 titled 'MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME

Simplified Explanation

The patent application describes a module board and a memory module. The module board has various signal lines and terminals for connecting clock signals between different modules.

  • The module board includes a first branch line that connects a clock signal terminal to a first branch point.
  • A first signal line connects the first branch point to a first module clock signal terminal.
  • A second signal line connects the first module clock signal terminal to the kmodule clock signal terminal and a first termination resistance terminal.
  • A third signal line connects the first branch point to a (k+1)module clock signal terminal.
  • A fourth signal line connects the (k+1)module clock signal terminal to a 2kmodule clock signal terminal and the second termination resistance terminal.
  • The length of the third signal line is greater than the combined length of the first signal line and the second signal line.

Potential applications of this technology:

  • Memory modules in computer systems
  • High-speed data transfer systems
  • Communication devices with multiple modules

Problems solved by this technology:

  • Efficient and reliable transmission of clock signals between modules
  • Minimizing signal degradation and interference
  • Simplifying the design and layout of module boards

Benefits of this technology:

  • Improved performance and reliability of memory modules
  • Faster data transfer rates
  • Simplified integration of multiple modules in a system


Original Abstract Submitted

A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kmodule clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)module clock signal terminal; and a fourth signal line for connecting the (k+1)module clock signal terminal to a 2kmodule clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.