18495735. VEHICLE-MOUNTABLE DEVICE AND VEHICLE simplified abstract (Huawei Technologies Co., Ltd.)
Contents
VEHICLE-MOUNTABLE DEVICE AND VEHICLE
Organization Name
Inventor(s)
Jianqiang Yin of Dongguan (CN)
VEHICLE-MOUNTABLE DEVICE AND VEHICLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18495735 titled 'VEHICLE-MOUNTABLE DEVICE AND VEHICLE
Simplified Explanation
The patent application describes a vehicle-mountable device with a first temperature equalization board and a PCB housed inside a housing. The first temperature equalization board is near a first inner wall of the housing, while the PCB is close to a second inner wall. A first protrusion and a first heat pipe are located on the side of the first temperature equalization board, while a first heat emission component is on the side of the PCB.
- First temperature equalization board and PCB are fastened inside a housing
- First temperature equalization board is close to the first inner wall, PCB is close to the second inner wall
- First protrusion and first heat pipe on the side of the first temperature equalization board
- First heat emission component on the side of the PCB
- Position of the first protrusion corresponds to the position of the first heat emission component
Potential applications of this technology: - Vehicle-mounted electronic devices - Temperature control systems in vehicles
Problems solved by this technology: - Ensures efficient heat dissipation - Prevents overheating of electronic components in a vehicle
Benefits of this technology: - Improved performance and longevity of electronic devices - Enhanced safety by preventing overheating issues in vehicles
Original Abstract Submitted
This application discloses a vehicle-mountable device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.
