17933693. MICROSTRIP CROSSTALK REDUCTION simplified abstract (International Business Machines Corporation)

MICROSTRIP CROSSTALK REDUCTION

Organization Name

International Business Machines Corporation

Inventor(s)

Matthew Doyle of Chatfield MN (US)

DAVID CLIFFORD Long of WAPPINGERS FALLS NY (US)

Matteo Cocchini of New York NY (US)

Russell A. Budd of North Salem NY (US)

James Busby of New Paltz NY (US)

Roger S. Krabbenhoft of Rochester MN (US)

Arthur J. Higby of Cottekill NY (US)

MICROSTRIP CROSSTALK REDUCTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17933693 titled 'MICROSTRIP CROSSTALK REDUCTION

Simplified Explanation

The electronic component described in the patent application includes a first trace and a second trace for transmitting signals, separated by a layer of insulative material. The component also features vertical walls in direct contact with a layer of conductive material, with a void between them extending between the first and second traces.

• The electronic component includes a first trace and a second trace for transmitting signals.
• The traces are separated by a layer of insulative material.
• Vertical walls are in direct contact with a layer of conductive material.
• A void between the vertical walls extends between the first and second traces.

Potential Applications

This technology could be applied in:

• High-speed data transmission systems
• Printed circuit boards
• Integrated circuits

Problems Solved

This technology helps to:

• Improve signal transmission efficiency
• Reduce signal interference
• Enhance overall electronic component performance

Benefits

The benefits of this technology include:

• Increased reliability of electronic components
• Enhanced signal quality
• Improved overall system performance

Potential Commercial Applications

Potential commercial applications of this technology could include:

• Telecommunications equipment
• Consumer electronics
• Automotive electronics

Possible Prior Art

One possible prior art for this technology could be the use of vertical walls in electronic components to improve signal transmission efficiency.

Unanswered Questions

How does this technology compare to existing signal transmission methods?

This article does not provide a direct comparison between this technology and traditional signal transmission methods.

What are the potential limitations of implementing this technology in electronic components?

This article does not address any potential limitations or challenges that may arise when implementing this technology in electronic components.

Original Abstract Submitted

An electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. The electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. The electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. The electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. The second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.