18465803. LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE simplified abstract (NICHIA CORPORATION)
Contents
- 1 LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE
Organization Name
Inventor(s)
Shota Takase of Tokushima-shi (JP)
Masanori Uemura of Anan-shi (JP)
Masakazu Sakamoto of Tokushima-shi (JP)
Yosuke Noda of Tokushima-shi (JP)
LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18465803 titled 'LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE
Simplified Explanation
The abstract describes a patent application for a light-emitting module that includes light-emitting devices and a wiring substrate. Each light-emitting device has light-emitting elements and a package with a wiring region on its lower surface. The wiring substrate consists of a metal portion, an electrode portion, and an insulating portion, with first through holes defined. The wiring region of the light-emitting devices is bonded to the electrode portion of the wiring substrate.
- Light-emitting module with light-emitting devices and wiring substrate
- Light-emitting devices have light-emitting elements and packages with wiring regions
- Wiring substrate has metal, electrode, and insulating portions with first through holes
- Wiring region of light-emitting devices bonded to electrode portion of wiring substrate
Potential Applications
The technology could be applied in:
- LED lighting systems
- Display panels
- Automotive lighting
Problems Solved
This technology helps in:
- Efficiently connecting light-emitting devices to a wiring substrate
- Ensuring proper electrical connections
- Enhancing the overall performance of light-emitting modules
Benefits
The benefits of this technology include:
- Improved reliability and durability of light-emitting modules
- Simplified manufacturing processes
- Enhanced electrical connectivity
Potential Commercial Applications
The technology could find commercial applications in:
- Lighting industry
- Electronics manufacturing
- Automotive sector
Possible Prior Art
One possible prior art could be the use of traditional wiring methods for connecting light-emitting devices, which may not be as efficient or reliable as the described technology.
Unanswered Questions
How does this technology compare to existing methods of connecting light-emitting devices to wiring substrates?
This article does not provide a direct comparison with existing methods, leaving the reader to wonder about the specific advantages or differences.
What specific industries or applications could benefit the most from this technology?
The article does not delve into the specific industries or applications that could see the most significant advantages from implementing this technology.
Original Abstract Submitted
A light-emitting module includes one or more light-emitting devices, and a wiring substrate. Each of the light-emitting devices includes light-emitting elements, and a package including a lower surface having a wiring region. The wiring substrate includes a metal portion, an electrode portion, and an insulating portion, and defines one or more first through holes. The mounting surface of the wiring substrate includes a first region where the metal portion defines an uppermost surface, a second region where the electrode portion defines an uppermost surface, and a third region where the insulating portion defines an uppermost surface. The first region and the second region are separated from each other by the third region. A boundary of each of the first through holes is defined in the first region. The wiring region of each of the light-emitting devices is bonded to the electrode portion of the wiring substrate.
