17644431. Integrated Attenuator with Thermal Vias simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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Integrated Attenuator with Thermal Vias

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Young Kwark of Chappaqua NY (US)

Integrated Attenuator with Thermal Vias - A simplified explanation of the abstract

This abstract first appeared for US patent application 17644431 titled 'Integrated Attenuator with Thermal Vias

Simplified Explanation

The abstract describes an attenuator, which is a device used to reduce the amplitude of a signal. This attenuator includes several layers and components that help manage and dissipate heat generated by a resistor.

  • The attenuator consists of a first thermal reservoir and a first metal layer on top of it.
  • On top of the first metal layer, there is a first dielectric layer.
  • A resistor is placed on top of the first dielectric layer.
  • A second dielectric layer is located on top of the resistor.
  • A second metal layer is placed on top of the second dielectric layer.
  • A second thermal reservoir is located on top of the third metal layer.
  • The resistor is split or perforated by a thermal shunt, which includes a thermal column.
  • The thermal column directs the heat generated by the resistor vertically upwards or downwards into the first and second thermal reservoirs, respectively.

Potential Applications

  • Signal attenuation in electronic devices.
  • Heat management in high-power circuits.
  • Thermal dissipation in electronic components.

Problems Solved

  • Efficient heat dissipation in attenuators.
  • Prevention of overheating in electronic devices.
  • Improved performance and longevity of electronic components.

Benefits

  • Enhanced heat management capabilities.
  • Increased reliability and durability of electronic devices.
  • Improved performance of attenuators and electronic circuits.


Original Abstract Submitted

An attenuator comprising a first thermal reservoir and a first metal layer located on top of the first thermal reservoir. A first dielectric layer located on top of the first metal layer and a resistor located on top the first dielectric layer. A second dielectric layer located on top of the resistor and a second metal layer located on top of the second dielectric layer. A second thermal reservoir located on top the third metal layer and wherein the resistor is split or perforated by a thermal shunt, wherein the thermal shunt includes a thermal column that directs the heat generated by the resistor vertically upwards or downwards into the first and second thermal reservoirs, respectively.

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