17968308. PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONIC DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
Yeonkyung Chung of Suwon-si (KR)
PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17968308 titled 'PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONIC DEVICE INCLUDING THE SAME
Simplified Explanation
The abstract describes a printed circuit board and/or an electronic device that includes an insulation layer with a rigid region and a flexible region. It also includes a circuit pattern that partially transverses the flexible region and conductive pads on the circuit pattern in the rigid region. The flexible region is designed to deform more than the rigid region.
- The invention is a printed circuit board and/or electronic device with a flexible region and a rigid region.
- The flexible region allows for more deformation compared to the rigid region.
- The device includes a circuit pattern that partially transverses the flexible region.
- Conductive pads are formed on the circuit pattern in the rigid region.
Potential Applications
- Consumer electronics such as smartphones, tablets, and wearables.
- Automotive electronics for flexible and adaptable systems.
- Aerospace and defense applications for lightweight and flexible circuitry.
Problems Solved
- Provides flexibility and adaptability to electronic devices.
- Allows for more deformation without damaging the circuitry.
- Enables the use of flexible circuitry in various industries.
Benefits
- Increased durability and reliability of electronic devices.
- Enables the development of more compact and lightweight devices.
- Provides flexibility for design and manufacturing of electronic systems.
Original Abstract Submitted
A printed circuit board and/or an electronic device including the same are provided. The printed circuit board and/or an electronic device includes at least one insulation layer including a first rigid region and a flexible region extending from the first rigid region, at least one first circuit pattern disposed on one surface of the at least one insulation layer to at least partially transverse the flexible region from the first rigid region, and at least one conductive pad formed at least partially on a surface of the first circuit pattern in the first rigid region, wherein the flexible region may be configured to flexibly deform more than the first rigid region.
