18480343. WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
Contents
- 1 WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE
Organization Name
Inventor(s)
TOSHIYUKI Yoshida of Kanagawa (JP)
WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18480343 titled 'WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE
Simplified Explanation
The abstract describes a patent application for a wiring board that includes a wiring layer, a shield layer, and an insulating layer. The wiring layer contains signal and ground lines, while the shield layer overlaps the wiring layer with the insulating layer in between. A connection conductor line connects the shield layer to the ground line.
- Wiring board with wiring layer, shield layer, and insulating layer
- Wiring layer has signal and ground lines
- Shield layer overlaps wiring layer with insulating layer in between
- Connection conductor line connects shield layer to ground line
Potential Applications
The technology described in this patent application could be used in various electronic devices and systems that require efficient signal transmission and grounding, such as:
- Printed circuit boards
- Electronic control units
- Communication systems
Problems Solved
This technology addresses the following issues in wiring boards and electronic systems:
- Signal interference
- Grounding inefficiencies
Benefits
The benefits of this technology include:
- Improved signal transmission
- Enhanced grounding capabilities
- Reduced signal interference
Potential Commercial Applications
The technology could have commercial applications in industries such as:
- Electronics manufacturing
- Telecommunications
- Automotive industry
Possible Prior Art
One possible prior art for this technology could be the use of multilayer wiring boards with shield layers for signal integrity and grounding purposes.
Unanswered Questions
How does this technology compare to existing wiring board designs in terms of signal transmission efficiency?
The article does not provide a direct comparison between this technology and existing wiring board designs in terms of signal transmission efficiency. Further research or testing would be needed to determine the specific advantages of this technology in this aspect.
What are the potential challenges in implementing this technology in mass production of electronic devices?
The article does not address the potential challenges in implementing this technology in mass production of electronic devices. Factors such as cost, scalability, and compatibility with existing manufacturing processes could pose challenges that need to be explored further.
Original Abstract Submitted
A wiring board includes a wiring layer, a shield layer, and an insulating layer. The wiring layer includes at least one signal line and at least one ground line. The shield layer overlaps the wiring layer in plan view. The insulating layer is provided between the wiring layer and the shield layer. The insulating layer includes at least one end portion surrounded by the insulating layer. The at least one end portion is located on at least the at least one ground line. A connection conductor line electrically connecting the shield layer to the at least one ground line is provided on part of the at least one end portion.
