Huawei technologies co., ltd. (20240138060). PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

Organization Name

huawei technologies co., ltd.

Inventor(s)

Wei Tao of Dongguan (CN)

Yupeng Jin of Dongguan (CN)

Yalei Sang of Dongguan (CN)

Zhenyu Chen of Dongguan (CN)

Wusiman Zaimuran of Shenzhen (CN)

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240138060 titled 'PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

Simplified Explanation

The abstract describes a printed circuit board with a core board and a substrate, where the core board includes conductive layers and a flexible dielectric layer.

• The core board covers and is disposed on an outer surface of the substrate.
• The first conductive layer is located on the side of the core board away from the substrate.
• The second conductive layer is located on the side of the core board close to the substrate.
• The first dielectric layer is located between the first and second conductive layers and includes a flexible dielectric layer with a specific Young's modulus requirement.

Potential Applications

This technology could be used in various electronic devices and systems that require flexible printed circuit boards, such as wearable technology, flexible displays, and medical devices.

Problems Solved

This innovation solves the problem of rigid printed circuit boards not being suitable for applications that require flexibility and bending, as the flexible dielectric layer allows for greater flexibility without compromising performance.

Benefits

The benefits of this technology include improved flexibility, reduced risk of damage from bending or flexing, and enhanced reliability in applications where traditional rigid circuit boards may fail.

Potential Commercial Applications

Potential commercial applications for this technology include flexible electronics, IoT devices, medical sensors, and automotive electronics. A SEO optimized title for this section could be "Commercial Applications of Flexible Printed Circuit Boards."

Possible Prior Art

One possible prior art could be the use of flexible substrates in printed circuit boards to achieve some level of flexibility, but the specific configuration of conductive layers and the Young's modulus requirement for the dielectric layer as described in this patent application may be novel.

How does this technology compare to existing flexible printed circuit board solutions on the market?

This article does not provide a direct comparison with existing flexible printed circuit board solutions, so it is unclear how this technology stands out in terms of performance, cost, or other factors.

What are the specific industries or applications that would benefit the most from this technology?

While the article mentions potential applications like wearable technology and medical devices, it does not delve into specific industries or use cases where this technology would have the most significant impact.

Original Abstract Submitted

embodiments of this application provide a printed circuit board, including a core board and a substrate. the core board covers and is disposed on an outer surface of the substrate. the core board includes a first conductive layer, a second conductive layer, and a first dielectric layer. the first conductive layer is located on a side that is of the core board and that is away from the substrate, the second conductive layer is located on a side that is of the core board and that is close to the substrate, and the first dielectric layer is located between the first conductive layer and the second conductive layer, and includes a flexible dielectric layer whose young's modulus is less than or equal to a preset young's modulus.