Dell products l.p. (20240130033). HEATSINK BASED POWER DELIVERY FOR CPUS simplified abstract
Contents
- 1 HEATSINK BASED POWER DELIVERY FOR CPUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HEATSINK BASED POWER DELIVERY FOR CPUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
HEATSINK BASED POWER DELIVERY FOR CPUS
Organization Name
Inventor(s)
Sandor Farkas of Round Rock TX (US)
Mark Smith of Georgetown TX (US)
Bhyrav Mutnury of Austin TX (US)
HEATSINK BASED POWER DELIVERY FOR CPUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240130033 titled 'HEATSINK BASED POWER DELIVERY FOR CPUS
Simplified Explanation
The patent application describes an information handling system with a PCB, CPU, power distribution hat, and heat sink. The PCB has power and ground contacts, the CPU is affixed to the PCB, and the power distribution hat and heat sink connect the power and ground contacts.
- PCB with power and ground contacts
- CPU affixed to PCB with power and ground contacts
- Power distribution hat connecting power contacts
- Heat sink connecting ground contacts
Potential Applications
The technology described in this patent application could be applied in various electronic devices such as computers, servers, and networking equipment.
Problems Solved
This technology solves the problem of efficiently distributing power and dissipating heat in electronic devices, improving their performance and reliability.
Benefits
The benefits of this technology include improved thermal management, enhanced system stability, and increased overall performance of electronic devices.
Potential Commercial Applications
The technology could be used in the design and manufacturing of high-performance computers, servers, and other electronic devices, catering to industries such as data centers, telecommunications, and cloud computing.
Possible Prior Art
One possible prior art could be the use of heat sinks and power distribution components in electronic devices to manage heat and power distribution. However, the specific configuration and integration described in this patent application may be novel and inventive.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
The article does not provide information on the cost-effectiveness of this technology compared to existing solutions. Further research and analysis would be needed to determine the cost implications of implementing this innovation.
What are the potential challenges in implementing this technology on a large scale?
The article does not address the potential challenges that may arise in implementing this technology on a large scale. Factors such as manufacturing complexity, compatibility with existing systems, and scalability issues would need to be considered in real-world applications.
Original Abstract Submitted
an information handling system includes a pcb, a cpu, a power distribution hat, and a heat sink. the pcb includes a first power contact on a first surface of the pcb and a first ground contact on a second surface of the pcb. the cpu includes a substrate and is affixed and electrically coupled to the first surface of the pcb by a first surface of the substrate. a second surface of the substrate includes a second power contact and a second ground contact. the power distribution hat couples the first power contact with the second power contact. the heat sink couples the first ground contact with the second ground contact.
