18399565. TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS simplified abstract (Intel Corporation)
Contents
- 1 TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS
Organization Name
Inventor(s)
Zhichao Z. Zhang of Shanghai (CN)
Xiaoguo Liang of Shanghai (CN)
TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18399565 titled 'TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS
Simplified Explanation
The patent application describes technologies for a flexible three-dimensional power plane in a chassis, where a flexible ribbon cable is secured to a circuit board tray using power bosses to distribute power to various locations on the circuit board without requiring large traces.
- Flexible ribbon cable laid along a circuit board tray
- Secured to the tray using power bosses
- Power bosses connect to conductors on the ribbon cable
- Power bosses extend through holes in the circuit board and mate with power clips on the tray surface
- Distributes power to various locations on the circuit board without large traces
Potential Applications
The technology could be applied in various electronic devices and systems where a flexible power distribution system is needed, such as servers, computers, and other electronic equipment with complex power requirements.
Problems Solved
This technology solves the problem of limited space on circuit boards due to large power traces, allowing for more efficient power distribution in three-dimensional configurations.
Benefits
The benefits of this technology include more flexible power distribution, reduced space requirements on circuit boards, and improved overall efficiency in power management within electronic devices.
Potential Commercial Applications
Potential commercial applications of this technology could include server farms, data centers, telecommunications equipment, and other high-performance electronic systems requiring flexible and efficient power distribution solutions.
Possible Prior Art
One possible prior art could be the use of flexible ribbon cables in electronic devices for various purposes, but the specific implementation of securing the ribbon cable to a circuit board tray using power bosses for power distribution may be a novel aspect of this technology.
Unanswered Questions
How does this technology compare to traditional power distribution methods in terms of efficiency and space utilization?
This article does not provide a direct comparison between this technology and traditional power distribution methods, leaving the reader to speculate on the potential advantages and disadvantages of each approach.
What are the potential challenges or limitations of implementing this technology in real-world applications?
The article does not address any potential challenges or limitations that may arise when implementing this technology in practical electronic devices, leaving room for further exploration and analysis in this area.
Original Abstract Submitted
Technologies for a flexible three-dimensional power plane in a chassis are disclosed. In one embodiment, a flexible ribbon cable is laid along a circuit board tray. The flexible ribbon cable is secured to the tray using power bosses. The power bosses connect to one or more conductors on the ribbon cable. When the circuit board is mounted on the circuit board tray, the power bosses extend through holes in the circuit board and mate with power clips on the surface of the circuit board tray. The ribbon cable, power bosses, and power clips can distribute power to various locations on the circuit board, without requiring large traces that take up space on the circuit board.
