18554170. WIRING BOARD simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
Contents
- 1 WIRING BOARD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 WIRING BOARD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
WIRING BOARD
Organization Name
NIPPON TELEGRAPH AND TELEPHONE CORPORATION
Inventor(s)
Hideaki Matsuzaki of Tokyo (JP)
WIRING BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18554170 titled 'WIRING BOARD
Simplified Explanation
The wiring board described in the patent application includes a dielectric substrate with a ground layer on one surface, a first conductor line and a first ground plane on the other surface, and a second conductor line below the first ground plane within the substrate.
- The wiring board has a dielectric substrate.
- A ground layer is located on one surface of the dielectric substrate.
- A first conductor line and a first ground plane are positioned on the other surface of the dielectric substrate, away from each other.
- A second conductor line is placed directly below the first ground plane within the dielectric substrate.
Potential Applications
This technology could be used in:
- High-frequency circuit boards
- Signal transmission systems
- RF/microwave applications
Problems Solved
This technology helps in:
- Improving signal integrity
- Reducing electromagnetic interference
- Enhancing overall circuit performance
Benefits
The benefits of this technology include:
- Enhanced signal transmission
- Improved circuit reliability
- Better overall system efficiency
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Telecommunications industry
- Aerospace and defense sector
- Electronics manufacturing companies
Possible Prior Art
One possible prior art for this technology could be the use of multilayer printed circuit boards in electronic devices to improve signal transmission and reduce interference.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
The cost-effectiveness of implementing this technology compared to traditional wiring board solutions is not addressed in the abstract.
What are the specific manufacturing processes involved in creating this wiring board?
The abstract does not provide details on the manufacturing processes used to produce this wiring board.
Original Abstract Submitted
A wiring board includes a dielectric substrate, a ground layer disposed on one surface of the dielectric substrate, a first conductor line and a first ground plane that are disposed apart from each other on the other surface opposing the one surface of the dielectric substrate, and a second conductor line disposed immediately below the first ground plane in the dielectric substrate.
