18267115. CIRCUIT BOARD simplified abstract (Mitsubishi Electric Corporation)
Contents
CIRCUIT BOARD
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Masatoshi Toyonaga of Tokyo (JP)
CIRCUIT BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18267115 titled 'CIRCUIT BOARD
Simplified Explanation
The abstract describes a circuit board design with two capacitors connected to a wiring pattern. A semiconductor device is mounted on the circuit board and connected to the wiring pattern. The circuit board is divided into two closed circuits, each consisting of the semiconductor device, wiring pattern, capacitor, interlayer joints, and ground plane.
- The circuit board design includes two capacitors connected to a wiring pattern.
- A semiconductor device is mounted on the circuit board and connected to the wiring pattern.
- The circuit board is divided into two closed circuits, each consisting of the semiconductor device, wiring pattern, capacitor, interlayer joints, and ground plane.
Potential Applications
- Electronics manufacturing
- Circuit board design and production
Problems Solved
- Efficient power supply connection in circuit boards
- Improved circuit board design and functionality
Benefits
- Enhanced performance and functionality of circuit boards
- Improved power supply connection and stability
Original Abstract Submitted
In a circuit board (A), a first capacitor () extends from a wiring pattern () to a region located on one side of the wiring pattern () in the width direction. A second capacitor () extends from the wiring pattern () to a region located on the other side of the wiring pattern () in the width direction. With a semiconductor device () mounted on the circuit board (A), a power supply terminal () is electrically connected to the wiring pattern (). The semiconductor device (), the wiring pattern (), the first capacitor (), a first interlayer joint (), a ground plane (), and a third interlayer joint () constitute a first closed circuit. The semiconductor device (), the wiring pattern (), the second capacitor (), a second interlayer joint (), the ground plane (), and the third interlayer joint () constitute a second closed circuit.
