International business machines corporation (20240098882). MICROSTRIP CROSSTALK REDUCTION simplified abstract

MICROSTRIP CROSSTALK REDUCTION

Organization Name

international business machines corporation

Inventor(s)

Matthew Doyle of Chatfield MN (US)

DAVID CLIFFORD Long of WAPPINGERS FALLS NY (US)

Matteo Cocchini of New York NY (US)

Russell A. Budd of North Salem NY (US)

James Busby of New Paltz NY (US)

Roger S. Krabbenhoft of Rochester MN (US)

Arthur J. Higby of Cottekill NY (US)

MICROSTRIP CROSSTALK REDUCTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240098882 titled 'MICROSTRIP CROSSTALK REDUCTION

Simplified Explanation

The electronic component described in the abstract includes a first trace and a second trace for transmitting signals, separated by insulative material and surrounded by a layer of conductive material with vertical walls formed in direct contact with it.

• The electronic component includes a first trace for transmitting a first signal and a second trace for transmitting a second signal.
• The traces are separated by a layer of insulative material.
• A layer of conductive material surrounds the traces.
• Vertical walls are formed in direct contact with the layer of conductive material.
• The vertical walls are separated by a void that extends between the first and second traces.

Potential Applications

This technology could be applied in high-speed electronic devices, such as computers, smartphones, and communication equipment, to improve signal transmission efficiency and reduce interference.

Problems Solved

This technology helps in reducing signal interference and improving signal transmission quality in electronic devices, leading to better overall performance and reliability.

Benefits

The benefits of this technology include enhanced signal transmission, reduced interference, improved performance of electronic devices, and increased reliability.

Potential Commercial Applications

Potential commercial applications of this technology include high-speed data transmission systems, telecommunications equipment, networking devices, and other electronic devices requiring efficient signal transmission.

Possible Prior Art

One possible prior art could be the use of shielding techniques in electronic components to reduce interference and improve signal transmission quality.

What materials are used in the layer of conductive material?

The abstract does not specify the exact materials used in the layer of conductive material.

How does the void between the vertical walls impact signal transmission?

The abstract does not provide information on how the void between the vertical walls affects signal transmission efficiency.

Original Abstract Submitted

an electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. the electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. the electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. the electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. the second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.