18090214. ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Han-Min Cho of Gyeonggi-do (KR)

Chan-Gi Park of Gyeonggi-do (KR)

Yeon-Sang Yun of Gyeonggi-do (KR)

Tae-Wook Ham of Gyeonggi-do (KR)

Hei-Seong Kwak of Gyeonggi-do (KR)

Byoung-II Son of Gyeonggi-do (KR)

Sung-Chul Park of Seoul (KR)

ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18090214 titled 'ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT

Simplified Explanation

The patent application describes a portable communication device with a unique printed circuit board (PCB) design.

• The device includes a housing and a first PCB placed inside the housing.
• A wireless communication circuit is mounted on the first PCB.
• A second PCB is connected to the first PCB through a connection part.
• The second PCB has different sections with varying levels of flexibility.
• A signal line runs through the first, second, third, and fourth PCB portions, with some of the signal line located between vias.
• Vias are arranged in at least a partial area of the second or fourth PCB portions.

Potential applications of this technology:

• Mobile phones
• Tablets
• Smartwatches
• Portable gaming devices

Problems solved by this technology:

• Improved flexibility and durability of the PCB design
• Efficient use of space within the device
• Enhanced signal transmission and connectivity

Benefits of this technology:

• Increased reliability and longevity of portable communication devices
• Improved performance and functionality
• Cost-effective manufacturing process

Original Abstract Submitted

Disclosed is a portable communication device including a housing, a first printed circuit board (PCB) disposed in the housing, a wireless communication circuit mounted on the first PCB, and a second PCB including a connection part connected with the first PCB, a first PCB portion extended from the connection part and having greater flexibility than the connection part, a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion, a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion, a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion, a signal line extended to the connection part along the first, second, third, and fourth PCB portions, and vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion, wherein a portion of the signal line is located between some of the vias.