18390805. HEATSINK BASED POWER DELIVERY FOR CPUS simplified abstract (Dell Products L.P.)
Contents
- 1 HEATSINK BASED POWER DELIVERY FOR CPUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HEATSINK BASED POWER DELIVERY FOR CPUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
HEATSINK BASED POWER DELIVERY FOR CPUS
Organization Name
Inventor(s)
Sandor Farkas of Round Rock TX (US)
Mark Smith of Georgetown TX (US)
Bhyrav Mutnury of Austin TX (US)
HEATSINK BASED POWER DELIVERY FOR CPUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18390805 titled 'HEATSINK BASED POWER DELIVERY FOR CPUS
Simplified Explanation
The abstract describes an information handling system with a PCB, CPU, power distribution hat, and heat sink. The PCB has power and ground contacts, the CPU is affixed to the PCB, and the power distribution hat and heat sink connect power and ground contacts.
- PCB with power and ground contacts
- CPU affixed to PCB with power and ground contacts
- Power distribution hat connects power contacts
- Heat sink connects ground contacts
Potential Applications
The technology described in this patent application could be applied in various electronic devices that require efficient power distribution and heat dissipation, such as computers, servers, and other electronic systems.
Problems Solved
This technology solves the problem of ensuring proper power distribution and heat management in electronic devices, which is crucial for their optimal performance and longevity.
Benefits
The benefits of this technology include improved reliability and performance of electronic devices, as well as potentially extending their lifespan by maintaining proper power distribution and thermal management.
Potential Commercial Applications
The technology could be commercialized in the manufacturing of electronic devices, allowing companies to produce more reliable and efficient products for consumers.
Possible Prior Art
One possible prior art for this technology could be similar patents or innovations related to power distribution and heat dissipation in electronic devices.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of this technology compared to existing solutions.
What impact could this technology have on the energy efficiency of electronic devices?
This article does not address the potential impact of this technology on the energy efficiency of electronic devices.
Original Abstract Submitted
An information handling system includes a PCB, a CPU, a power distribution hat, and a heat sink. The PCB includes a first power contact on a first surface of the PCB and a first ground contact on a second surface of the PCB. The CPU includes a substrate and is affixed and electrically coupled to the first surface of the PCB by a first surface of the substrate. A second surface of the substrate includes a second power contact and a second ground contact. The power distribution hat couples the first power contact with the second power contact. The heat sink couples the first ground contact with the second ground contact.
