20240014794. Impedence Matching Conductive Structure for High Efficiency RF Circuits simplified abstract (3D Glass Solutions, Inc.)
Contents
Impedence Matching Conductive Structure for High Efficiency RF Circuits
Organization Name
Inventor(s)
Jeb H. Flemming of Albuquerque NM (US)
Kyle Mcwethy of Albuquerque NM (US)
Impedence Matching Conductive Structure for High Efficiency RF Circuits - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240014794 titled 'Impedence Matching Conductive Structure for High Efficiency RF Circuits
Simplified Explanation
The present invention is a method of making an RF impedance matching device using a photo-definable glass ceramic substrate. The invention includes the use of a ground plane to prevent disruptive signals and voltage build-up from affecting the performance of isolated electronic devices.
- The invention involves the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
- The method utilizes a ground plane adjacent to or below the RF transmission line to prevent parasitic electronic signals, RF signals, differential voltage build-up, and floating grounds from disrupting and degrading the performance of isolated electronic devices.
- The use of a photo-definable glass ceramic substrate allows for precise and accurate fabrication of the impedance matching device.
Potential applications of this technology:
- RF impedance matching devices are commonly used in wireless communication systems, such as cell phones, satellite communication, and radar systems.
- The technology can be applied in the design and manufacturing of RF amplifiers, filters, and antennas.
- It can also be used in medical devices, such as MRI machines, where RF impedance matching is crucial for optimal performance.
Problems solved by this technology:
- The invention addresses the issue of disruptive signals and voltage build-up that can degrade the performance of isolated electronic devices.
- It provides a solution for preventing parasitic electronic signals and RF signals from interfering with the operation of RF impedance matching devices.
- The use of a ground plane helps to eliminate floating grounds, which can cause instability and signal degradation.
Benefits of this technology:
- Improved performance and reliability of RF impedance matching devices.
- Enhanced signal integrity and reduced interference in wireless communication systems.
- Precise fabrication and accurate impedance matching due to the use of a photo-definable glass ceramic substrate.
Original Abstract Submitted
the present invention includes a method of making a rf impedance matching device in a photo definable glass ceramic substrate. a ground plane may be used to adjacent to or below the rf transmission line in order to prevent parasitic electronic signals, rf signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
