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Category:H01L25/16
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Pages in category "H01L25/16"
The following 200 pages are in this category, out of 291 total.
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- 17289301. ARRAY SUBSTRATE, BACKLIGHT MODULE AND DISPLAY PANEL simplified abstract (TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 17460705. PACKAGE STRUCTURES AND METHOD FOR FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17597104. DISPLAY PANEL AND METHOD FOR FABRICATING THE SAME simplified abstract (WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.)
- 17610707. SUBSTRATE ENCAPSULATING METHOD, DISPLAY PANEL, AND DISPLAY DEVICE simplified abstract (TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 17622229. DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL, AND DISPLAY DEVICE simplified abstract (TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 17622336. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.)
- 17622801. DISPLAY PANEL MANUFACTURING METHOD AND DISPLAY PANEL simplified abstract (TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 17622850. DISPLAY PANEL AND SPLICING SCREEN simplified abstract (WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.)
- 17622884. DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME simplified abstract (TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 17623625. SPLICING SCREEN simplified abstract (Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.)
- 17699931. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 17725163. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17725729. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17735158. SEMICONDUCTOR PACKAGE ALIGNING INTERPOSER AND SUBSTRATE simplified abstract (Samsung Electronics Co., Ltd.)
- 17740422. DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 17747131. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17754552. DISPLAY DEVICE simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 17760817. DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17765387. ARRAY SUBSTRATE AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17768374. SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
- 17769455. DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME simplified abstract (Samsung Display Co., LTD.)
- 17809039. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17814828. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17815784. INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17816261. SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17821920. Warpage Compensation for BGA Package simplified abstract (Apple Inc.)
- 17846173. PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17849352. COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES simplified abstract (Intel Corporation)
- 17862482. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17877041. 3D High Bandwidth Memory and Optical Connectivity Stacking simplified abstract (GOOGLE LLC)
- 17877524. DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 17879594. PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION PORTION COUPLED TO A SECOND METALLIZATION PORTION simplified abstract (QUALCOMM Incorporated)
- 17887645. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 17894084. SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17897155. PACKAGE SUBSTRATE FOR A SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
- 17897156. MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS simplified abstract (Micron Technology, Inc.)
- 17898187. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 17899592. STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17900785. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17916915. POV DISPLAY DEVICE AND CONTROL METHOD THEREFOR simplified abstract (LG Electronics Inc.)
- 17920340. DISPLAY SUBSTRATE, METHOD FOR PREPARING DISPLAY SUBSTRATE, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17932209. DIE PACKAGE WITH SEALED DIE ENCLOSURES simplified abstract (QUALCOMM Incorporated)
- 17943299. LIGHT EMITTING DIODE PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17943354. TECHNOLOGIES FOR GLASS CORE INDUCTOR simplified abstract (Intel Corporation)
- 17946109. WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17949334. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 17954509. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 17956134. DISPLAY MODULE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
- 17957003. HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract (Intel Corporation)
- 17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation)
- 17959428. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 17960151. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17960871. STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM simplified abstract (Texas Instruments Incorporated)
- 17960876. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 17964583. REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIPS AND SYSTEM-ON-CHIP DEVICE PACKAGES simplified abstract (NVIDIA Corporation)
- 17968830. ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract (Intel Corporation)
- 17972202. DISPLAY MODULE simplified abstract (Samsung Electronics Co., Ltd.)
- 17983290. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 17983711. DISPLAY DEVICE, ELECTRONIC DEVICE, AND FABRICATION METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17985332. MICRO CHIP AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17993252. DISPLAY DEVICE AND MANUFACTURING METHOD FOR THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)
- 18070825. INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18084118. DISPLAY APPARATUS AND LIGHT-EMITTING DIODE MODULE simplified abstract (Samsung Electronics Co., Ltd.)
- 18092504. INPUT SENSING DEVICE AND A DISPLAY DEVICE INCLUDING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18094112. NANOWIRE LED, DISPLAY MODULE INCLUDING THE NANOWIRE LED, AND METHOD FOR MANUFACTURING THE DISPLAY MODULE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18097647. DISPLAY PANEL AND OPERATION METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18100153. DISPLAY DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18114085. ISOLATOR simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18117736. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18120025. DISPLAY DEVICE simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18139848. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18146591. WIRE BONDS FOR GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18151044. Packages With Photonic Engines and Method of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18158514. LED CHIP PACKAGING MODULE, FABRICATION METHOD THEREOF, AND DISPLAY simplified abstract (Huawei Technologies Co., Ltd.)
- 18166985. LIGHT EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18167415. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18172975. WAFER LEVEL PACKAGING PROCESS FOR THIN FILM INDUCTORS simplified abstract (QUALCOMM Incorporated)
- 18176695. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18178531. MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract (SK hynix Inc.)
- 18188368. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18194808. DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18197998. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18212652. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18214341. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18221699. LED DISPLAY APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy)
- 18233863. MULTI-DIE PACKAGE ON PACKAGE simplified abstract (MediaTek Inc.)
- 18234296. DISPLAY PANEL, METHOD OF MANUFACTURING THE DISPLAY PANEL, AND ELECTRONIC APPARATUS INCLUDING THE DISPLAY PANEL simplified abstract (Samsung Display Co., LTD.)
- 18244716. DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE simplified abstract (GOOGLE LLC)
- 18244739. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18262828. DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME, DISPLAY DEVICE, AND TILED DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18265172. DISPLAY DEVICE simplified abstract (LG ELECTRONICS INC.)
- 18265578. BONDED CONNECTION MEANS simplified abstract (Siemens Aktiengesellschaft)
- 18303380. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18310602. DISPLAY DEVICE simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18312191. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18316582. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18317327. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18319336. DISPLAY APPARATUS simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18325216. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18328875. DISPLAY DEVICE, METHOD OF FABRICATING THE SAME, AND TILED DISPLAY DEVICE simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18334512. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18338933. IMAGE SENSOR PACKAGE INCLUDING A CHIP STACK STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18339583. LIGHT EMITTING ELEMENT, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE DISPLAY DEVICE simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18343221. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18348995. DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18354252. DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18358301. DISPLAY DEVICE simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18359758. PIXEL AND DISPLAY DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18361994. ELECTRONIC DEVICE simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18363937. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18364339. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18364399. METAL CHALCOGENIDE THIN FILM, THIN-FILM TRANSISTOR INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE THIN-FILM TRANSISTOR simplified abstract (Samsung Display Co., LTD.)
- 18365692. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18375194. LIGHT EMITTING DEVICE, DISPLAY APPARATUS INCLUDING THE SAME ANDMANUFACTURING METHOD OF THE LIGHT EMITTING DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18390395. STANDALONE ISOLATION CAPACITOR simplified abstract (Texas Instruments Incorporated)
- 18395437. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18395966. DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18449052. DISPLAY DEVICE, TILED DISPLAY DEVICE, AND MANUFACTURING METHOD FOR DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18449240. DISPLAY DEVICE simplified abstract (LG Display Co., Ltd.)
- 18450664. Method of Transferring Patterned Micro-LED Die onto a Silicon Carrier for Wafer-to-Wafer Hybrid Bonding to a CMOS Backplane simplified abstract (Apple Inc.)
- 18453190. METHOD OF FABRICATING DISPLAY PANEL simplified abstract (Samsung Display Co., LTD.)
- 18456410. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18457840. DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18458816. BACKPLANE SUBSTRATE, DISPLAY DEVICE, AND TILED DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18459771. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18464302. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18465272. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18467062. PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18468468. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18469234. APPARATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF simplified abstract (Samsung Display Co., Ltd.)
- 18470162. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18475956. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18480402. LIGHT EMITTING DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Display Co., LTD.)
- 18488705. PIXEL AND DISPLAY DEVICE HAVING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18492681. DISPLAY DEVICE, ELECTRONIC DEVICE, AND IMAGE DATA COMPENSATING METHOD OF DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18535584. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18537258. INSULATION MODULE simplified abstract (Rohm Co., Ltd.)
- 18537324. INSULATION MODULE simplified abstract (Rohm Co., Ltd.)
- 18544371. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
2
- 20240014359. ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
- 20240038773. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.)
- 20240047442. LIGHT-EMITTING DIODE PANEL AND SPLICED PANEL simplified abstract (HUIZHOU CHINA STAR OPTOELECTRONICS DISPLAY CO., LTD.)
- 20240055416. WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME simplified abstract (SJ Semiconductor (Jiangyin) Corporation)
A
- Apple inc. (20240097087). Method of Transferring Patterned Micro-LED Die onto a Silicon Carrier for Wafer-to-Wafer Hybrid Bonding to a CMOS Backplane simplified abstract
- Apple inc. (20240136345). Light Emitting Structure simplified abstract
- Apple Inc. patent applications on April 25th, 2024
- Apple Inc. patent applications on March 21st, 2024
B
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 25th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 28th, 2024
- Blockchain patent applications on March 7th, 2024
- BOE TECHNOLOGY GROUP CO., LTD. patent applications on February 8th, 2024
I
- Intel corporation (20240103216). VERTICAL THROUGH-SILICON WAVEGUIDE FABRICATION METHOD AND TOPOLOGIES simplified abstract
- Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract
- Intel corporation (20240113158). HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract
- Intel corporation (20240114623). HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract
- Intel corporation (20240136269). ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on April 25th, 2024
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on January 18th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on March 14th, 2024
- Intel Corporation patent applications on March 28th, 2024
K
N
Q
- Qualcomm incorporated (20240105568). PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS simplified abstract
- Qualcomm incorporated (20240105760). INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD simplified abstract
- QUALCOMM Incorporated patent applications on February 1st, 2024
- QUALCOMM Incorporated patent applications on February 29th, 2024
- QUALCOMM Incorporated patent applications on February 8th, 2024
- QUALCOMM Incorporated patent applications on March 14th, 2024
- QUALCOMM Incorporated patent applications on March 28th, 2024