17815784. INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
Contents
- 1 INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
Organization Name
Inventor(s)
Jui-Yi Chiu of Taichung City (TW)
Nosun Park of San Diego CA (US)
Je-Hsiung Lan of San Diego CA (US)
Jonghae Kim of San Diego CA (US)
Periannan Chidambaram of San Diego CA (US)
INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17815784 titled 'INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
Simplified Explanation
The patent application describes inductor packages that use wire bonds over a lead frame to create integrated inductors. These inductor packages can be used in integrated circuit (IC) packages. The lead frame is formed into a pattern and the leads are coupled together through wire bonds to create the inductor coil(s). An overmold material is then formed over the lead frame, with the coil(s) formed from the wire-bonded leads, to create the inductor package. The overmold material can include a magnetic material to increase the inductance of the integrated inductor(s). The inductor package can be mounted to an IC package substrate to provide inductor(s) for a circuit in the IC package. The use of a lead frame allows for the use of existing fabrication processes, making it a simpler and more cost-effective manufacturing method.
- Inductor packages using wire bonds over a lead frame to create integrated inductors
- Overmold material formed over the lead frame to create the inductor package
- Magnetic material can be included in the overmold material to increase inductance
- Inductor package can be mounted to an IC package substrate
- Utilizes existing lead frame fabrication processes for simpler and cost-effective manufacturing
Potential Applications
- Integrated circuit packages
- Electronics manufacturing
Problems Solved
- Simplifies the manufacturing process for inductor packages
- Reduces costs associated with inductor package fabrication
Benefits
- Cost-effective manufacturing method
- Utilizes existing fabrication processes
- Increased inductance with the use of magnetic material
Original Abstract Submitted
Inductor packages employing wire-bonds over a lead frame to form integrated inductor(s), and related integrated circuit (IC) packages and fabrication methods. The inductor package includes one or more integrated inductors each formed from leads of a lead frame coupled together in a pattern through wire bonds to foil a coil(s). An overmold material is formed over the lead frame with the coil(s) formed from the wire-bonded leads to form the inductor package. The overmold material can include a magnetic material to further increase the inductance of the integrated inductor(s). The inductor package can be mounted to a package substrate of an IC package to provide an inductor(s) for a circuit in the IC package. By using a lead frame to form an inductor package, fabrication processes used to form lead frames can also be used to form the inductor package as a less complex, lower cost manufacturing method.
