17816261. SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Ting-Ting Kuo of Hsinchu City (TW)
Li-Hsien Huang of Zhubei City (TW)
Tien-Chung Yang of Hsinchu City (TW)
Yao-Chun Chuang of Hsinchu City (TW)
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 17816261 titled 'SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
Simplified Explanation
The abstract of this patent application describes a method for forming an adhesion layer over portions of a redistribution layer (RDL) in a semiconductor device package. The adhesion layer is formed over the portions of the RDL that are located in the "shadow" of one or more TIVs (Through Interconnect Vias) connected with the RDL structure. This adhesion layer, along with a seed layer, encapsulates the RDL portions in the shadow of the TIVs, promoting and increasing adhesion between the RDL portions and the polymer layers of the redistribution structure.
- The patent application describes a method for improving adhesion between the RDL and polymer layers in a semiconductor device package.
- An adhesion layer is formed over portions of the RDL that are in the shadow of one or more TIVs.
- The adhesion layer, along with a seed layer, encapsulates the RDL portions, enhancing adhesion.
- This method helps to prevent delamination or detachment of the RDL from the polymer layers.
Potential applications of this technology:
- Semiconductor device packaging
- Integrated circuits
- Electronic devices
Problems solved by this technology:
- Improves adhesion between the RDL and polymer layers, reducing the risk of delamination or detachment.
- Enhances the reliability and durability of semiconductor device packages.
Benefits of this technology:
- Increased adhesion between the RDL and polymer layers improves the overall reliability of semiconductor devices.
- Prevents delamination or detachment, reducing the risk of device failure.
- Provides a more robust and durable semiconductor device packaging solution.
Original Abstract Submitted
An adhesion layer may be formed over portions of a redistribution layer (RDL) in a redistribution structure of a semiconductor device package. The portions of the RDL over which the adhesion layer is formed may be located in the “shadow” of (e.g., the areas under and/or over and within the perimeter of) one or more TIVs that are connected with the redistribution layer structure. The adhesion layer, along with a seed layer on which the portions of the RDL are formed, encapsulate the portions of the RDL in the shadow of the one or more TIVs, which promotes and/or increases adhesion between the portions of the RDL and the polymer layers of the redistribution structure.
