18151044. Packages With Photonic Engines and Method of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 Packages With Photonic Engines and Method of Forming the Same
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Packages With Photonic Engines and Method of Forming the Same - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Packages With Photonic Engines and Method of Forming the Same
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Hsing-Kuo Hsia of Jhubei CIty (TW)
Jui Lin Chao of NewTaipei City (TW)
Packages With Photonic Engines and Method of Forming the Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 18151044 titled 'Packages With Photonic Engines and Method of Forming the Same
Simplified Explanation
The method involves patterning a top silicon layer in a substrate to create multiple photonic devices, embedding them in a second dielectric layer, forming an interconnect structure, bonding an electronic die, thinning the semiconductor layer, and creating dielectric regions with through-vias for electrical coupling.
- Patterning of top silicon layer to form photonic devices
- Embedding photonic devices in a second dielectric layer
- Forming an interconnect structure for signal coupling
- Thinning semiconductor layer and creating dielectric regions
- Forming through-vias for electrical coupling
Potential Applications
This technology could be applied in the development of advanced photonic devices for telecommunications, data processing, and sensing applications.
Problems Solved
This technology solves the challenge of integrating photonic and electronic components on the same substrate, enabling high-speed data transfer and signal processing.
Benefits
The benefits of this technology include improved performance, reduced footprint, and enhanced integration of photonic and electronic functionalities.
Potential Commercial Applications
Potential commercial applications of this technology include optical communication systems, data centers, and sensor networks.
Possible Prior Art
One possible prior art in this field is the integration of photonic devices on silicon substrates using various fabrication techniques.
Unanswered Questions
How does this technology compare to existing methods for integrating photonic and electronic components?
This article does not provide a direct comparison with existing methods for integrating photonic and electronic components.
What are the specific performance metrics of the photonic devices created using this method?
This article does not provide specific performance metrics of the photonic devices created using this method.
Original Abstract Submitted
A method includes patterning a top silicon layer in a substrate to form a plurality of photonic devices. The substrate includes the top silicon layer, a first dielectric layer under the top silicon layer, and a semiconductor layer under the first dielectric layer. The method further includes forming a second dielectric layer to embed the plurality of photonic devices therein, forming an interconnect structure over and signally coupling to the plurality of photonic devices, bonding an electronic die to the interconnect structure, thinning the semiconductor layer, and patterning the semiconductor layer that has been thinned to form openings. The openings are filled with a dielectric material to form dielectric regions. Through-vias are formed to penetrate through the dielectric regions to electrically couple to the interconnect structure.
