18176695. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyeonseok Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18176695 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes several components and structures to enhance heat dissipation and improve the overall performance of the package. Here is a simplified explanation of the abstract:
- The semiconductor package consists of a first redistribution structure, a first die, a second die, a heat dissipation unit, and a second redistribution structure.
- A first post extends from the upper surface of the first redistribution structure to the lower surface of the second redistribution structure.
- A second post connects the heat dissipation unit with a heat dissipation redistribution structure, creating a thermal path for heat dissipation.
- A molding unit fills the empty space between the first and second redistribution structures.
- The outer pad of the heat dissipation redistribution structure is exposed to the outside of the semiconductor package, while the inner pad is in contact with the second post.
Potential applications of this technology:
- This semiconductor package can be used in various electronic devices, such as smartphones, tablets, computers, and other devices that require efficient heat dissipation.
- It can be particularly beneficial in high-performance devices that generate a significant amount of heat, such as gaming consoles or servers.
Problems solved by this technology:
- The semiconductor package addresses the issue of heat dissipation, which is crucial for the proper functioning and longevity of electronic devices.
- By providing an effective thermal path and heat dissipation unit, the package helps prevent overheating and potential damage to the semiconductor components.
Benefits of this technology:
- Improved heat dissipation capabilities ensure the reliability and performance of the semiconductor package.
- The use of redistribution structures and posts allows for efficient heat transfer and dissipation, reducing the risk of overheating.
- The exposed outer pad of the heat dissipation redistribution structure provides an additional surface for heat dissipation, further enhancing the cooling efficiency.
Original Abstract Submitted
A semiconductor package includes a first redistribution structure, a first die above the first redistribution structure, a second die above the first die, a heat dissipation unit on side surfaces of the first die or the second die, and a second redistribution structure above the second die. The semiconductor package includes a first post protruding from an upper surface of the first redistribution structure and extending to a lower surface of the second redistribution structure, a second post connecting the heat dissipation unit with a heat dissipation redistribution structure as a thermal path, and a molding unit filling an empty space between the first redistribution structure and the second redistribution structure. An outer pad of the heat dissipation redistribution structure is exposed to an outside of the semiconductor package, and an inner pad of the heat dissipation redistribution structure is in contact with the second post.
