17765387. ARRAY SUBSTRATE AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)

ARRAY SUBSTRATE AND DISPLAY DEVICE

Organization Name

BOE TECHNOLOGY GROUP CO., LTD.

Inventor(s)

Jie Lei of Beijing (CN)

Zouming Xu of Beijing (CN)

Jian Tian of Beijing (CN)

Chunjian Liu of Beijing (CN)

Xintao Wu of Beijing (CN)

Jie Wang of Beijing (CN)

Jianying Zhang of Beijing (CN)

Yajun Ma of Beijing (CN)

Zhi Zhang of Beijing (CN)

Zhentao Li of Beijing (CN)

Li Yin of Beijing (CN)

ARRAY SUBSTRATE AND DISPLAY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17765387 titled 'ARRAY SUBSTRATE AND DISPLAY DEVICE

Simplified Explanation

The array substrate includes a bonding area, a substrate, a first conductive layer, a first insulating layer, and a second conductive layer. The bonding area is provided with bonding pins, each including a first conductive portion and a second conductive portion in direct contact with each other.

• The array substrate consists of multiple layers including conductive and insulating layers.
• The bonding area on the substrate contains bonding pins with specific structures for connection.

Potential Applications

The technology described in this patent application could be used in various display devices, such as LCD screens, OLED displays, and touchscreens.

Problems Solved

This technology solves the problem of efficiently connecting different layers of the array substrate in a display device, ensuring proper functionality and durability.

Benefits

The benefits of this technology include improved connectivity, reduced signal interference, and enhanced overall performance of the display device.

Potential Commercial Applications

This innovative array substrate technology could be applied in the manufacturing of smartphones, tablets, computer monitors, and other electronic devices with display screens.

Possible Prior Art

One possible prior art could be the use of traditional bonding methods in array substrates for display devices, which may not provide the same level of efficiency and reliability as the technology described in this patent application.

How does this technology compare to existing bonding methods in terms of cost-effectiveness and reliability?

This article does not provide a direct comparison between this technology and existing bonding methods in terms of cost-effectiveness and reliability. Further research or testing may be needed to determine the advantages of this technology over traditional methods.

What are the specific manufacturing processes required to implement this technology in mass production?

The article does not detail the specific manufacturing processes required to implement this technology in mass production. Additional information on the production techniques and equipment needed would be beneficial for companies looking to adopt this innovation.

Original Abstract Submitted

An array substrate () and a display device. The array substrate () includes a bonding area (). The array substrate () includes a substrate (), a first conductive layer () on the substrate (), a first insulating layer () on one side of the first conductive layer () away from the substrate (), and a second conductive layer () on one side of the first insulating layer () away from the substrate (). The bonding area () is provided with bonding pins (), and the bonding pin () includes a first conductive portion () and a second conductive portion () located on the side of the first conductive portion () away from the substrate (), the first conductive portion () is located in the first conductive layer (), the second conductive portion () is located in the second conductive layer (), and the first conductive portion () is in direct contact with the second conductive portion (). The first insulating layer () is provided with at least one first opening (), and the orthographic projection of each of the first openings () on the substrate () covers the orthographic projections of the plurality of bonding pins () on the substrate ().