17897155. PACKAGE SUBSTRATE FOR A SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
Contents
PACKAGE SUBSTRATE FOR A SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kelvin Tan Aik Boo of Singapore (SG)
Chin Hui Chong of Singapore (SG)
PACKAGE SUBSTRATE FOR A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17897155 titled 'PACKAGE SUBSTRATE FOR A SEMICONDUCTOR DEVICE
Simplified Explanation
- The patent application discloses techniques, apparatuses, and systems related to a package substrate for a semiconductor device. - A semiconductor device assembly is described, including a packaged semiconductor device with one or more semiconductor dies coupled to a package-level substrate. - The package-level substrate has first contact pads on a first surface in a first configuration. - The packaged semiconductor device is coupled with an additional package-level substrate that has second contact pads on a second surface in the first configuration and third contact pads on a third surface in a different second configuration. - The additional package-level substrate includes circuitry to provide connectivity between the second and third contact pads. - This allows for the assembly of an adaptively compatible semiconductor device.
Potential Applications
- Semiconductor manufacturing industry - Electronic devices and gadgets - Automotive industry - Aerospace industry
Problems Solved
- Improved connectivity in semiconductor devices - Enhanced adaptability in semiconductor device assembly - Increased efficiency in packaging processes
Benefits
- Enhanced performance of semiconductor devices - Increased flexibility in device assembly - Improved reliability and connectivity - Potential cost savings in manufacturing processes
Original Abstract Submitted
This document discloses techniques, apparatuses, and systems relating to a package substrate for a semiconductor device. A semiconductor device assembly is described that includes a packaged semiconductor device having one or more semiconductor dies coupled to a package-level substrate. The package-level substrate has a first surface at which first contact pads are disposed in a first configuration. The packaged semiconductor device is coupled with an additional package-level substrate that includes a second surface having second contact pads disposed in the first configuration and a third surface having third contact pads disposed in a second configuration different from the first configuration. The additional package-level substrate includes circuitry coupling the second contact pads the third contact pads to provide connectivity at the third contact pads. In doing so, an adaptively compatible semiconductor device may be assembled.
