17768374. SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Hiroshi Oji of Kyoto-shi, Kyoto (JP)
Hiroyuki Shinkai of Kyoto-shi, Kyoto (JP)
Natsuki Sakamoto of Kyoto-shi, Kyoto (JP)
Naoyuki Sano of Kyoto-shi, Kyoto (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17768374 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a substrate with wirings, a semiconductor element, drive conductors, and a sealing resin covering the components. The first and second drive conductors are separated and the first drive conductor is smaller in volume than the second drive conductor.
- Substrate with wirings, semiconductor element, and drive conductors
- Sealing resin covering components
- First and second drive conductors separated and sized differently
Potential Applications
The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics that require efficient semiconductor components.
Problems Solved
This technology solves the problem of efficiently connecting drive conductors to a semiconductor element while ensuring proper insulation and protection with a sealing resin. It also addresses the issue of space constraints by using drive conductors of different sizes.
Benefits
The benefits of this technology include improved performance and reliability of semiconductor devices, reduced space requirements, and enhanced protection of components with the sealing resin.
Potential Commercial Applications
- "Innovative Semiconductor Device Technology for Consumer Electronics"
Possible Prior Art
There may be prior art related to semiconductor devices with drive conductors and sealing resins, but specific examples are not provided in the abstract.
Unanswered Questions
How does this technology compare to existing semiconductor device designs in terms of efficiency and reliability?
This article does not provide a direct comparison with existing semiconductor device designs, so it is unclear how this technology stacks up against current solutions.
What are the potential challenges in implementing this technology on a large scale for commercial production?
The abstract does not address the potential challenges in scaling up production of semiconductor devices using this technology, leaving room for further exploration and analysis.
Original Abstract Submitted
A semiconductor device includes: a substrate having an obverse and a reverse face; wirings on the obverse face such as a first and a second drive wiring; a semiconductor element connected to the first and second drive wirings; a first drive conductor on the same side as the semiconductor element with respect to the substrate outside of the semiconductor element as viewed in a thickness direction and connected to the first drive wiring; a second drive conductor on the same side as the semiconductor element with respect to the substrate outside of the semiconductor element as viewed in the thickness direction and connected to the second drive wiring; and a sealing resin covering the wirings and the semiconductor element, while also covering the first and second drive conductor such that their faces opposite to the substrate in the thickness direction are exposed. The first and the second drive conductor are separated in a direction parallel to the obverse face. The first drive conductor is smaller in volume than the second drive conductor.
