18070825. INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Abstract Explanation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Original Abstract Submitted
INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18070825 titled 'INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF
Simplified Explanation
Abstract Explanation
The abstract describes a patent application for an integrated circuit package and a method for manufacturing it. The method involves attaching elements to a substrate, molding the substrate, grinding the mold, attaching additional elements and connection members to the substrate, and attaching an interposer substrate with landing pads for electrical connection to a printed circuit board.
- The patent application is for an integrated circuit package and a method for manufacturing it.
- The method involves attaching elements to a substrate.
- The substrate is then molded using a mold.
- The mold is then ground.
- Additional elements and connection members are attached to the substrate.
- An interposer substrate with landing pads for electrical connection is attached to the substrate.
Potential Applications
- Electronic devices
- Integrated circuits
- Printed circuit boards
Problems Solved
- Efficient manufacturing of integrated circuit packages
- Improved electrical connection between components
- Enhanced functionality of electronic devices
Benefits
- Simplified manufacturing process
- Stronger electrical connections
- Increased functionality and performance of electronic devices
Original Abstract Submitted
Various embodiments of the disclosure relate to an integrated circuit package, an electronic device including same, and a manufacturing method therefor, the method comprising: attaching at least one first element to a first surface of a substrate; molding the first surface using a first mold; grinding the first mold; attaching at least one second element and at least one connection member comprising a conductive material to a second surface of the substrate; and attaching an interposer substrate including landing pads for an electrical connection with a printed circuit board included in an electronic device to the second surface of the substrate.
