17610707. SUBSTRATE ENCAPSULATING METHOD, DISPLAY PANEL, AND DISPLAY DEVICE simplified abstract (TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)
SUBSTRATE ENCAPSULATING METHOD, DISPLAY PANEL, AND DISPLAY DEVICE
Organization Name
TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Inventor(s)
Changming Xiang of Huizhou (CN)
SUBSTRATE ENCAPSULATING METHOD, DISPLAY PANEL, AND DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17610707 titled 'SUBSTRATE ENCAPSULATING METHOD, DISPLAY PANEL, AND DISPLAY DEVICE
Simplified Explanation
The present application describes a method for encapsulating a substrate, a display panel, and a display device. The method involves fabricating a switching device on a first underlay to form a switching substrate, and fabricating a light-emitting diode on a second underlay to form a light-emitting substrate. A frame glue is applied to the edge of either the switching substrate or the light-emitting substrate, and then the two substrates are bonded together using the frame glue to seal the light-emitting diode between them.
- The method involves encapsulating a substrate by bonding a switching substrate and a light-emitting substrate together using frame glue.
- A switching device is fabricated on a first underlay to form the switching substrate.
- A light-emitting diode is fabricated on a second underlay to form the light-emitting substrate.
- The frame glue is applied to the edge of either the switching substrate or the light-emitting substrate.
- The light-emitting diode is sealed between the switching substrate and the light-emitting substrate.
Potential Applications
- Display panels for electronic devices such as smartphones, tablets, televisions, etc.
- Lighting panels for various applications such as indoor lighting, automotive lighting, etc.
Problems Solved
- Provides a method for encapsulating a substrate, ensuring the protection and stability of the components.
- Enables the fabrication of a switching device and a light-emitting diode on separate underlays, allowing for better control and optimization of each component.
- The bonding of the substrates using frame glue provides a secure and reliable seal for the light-emitting diode.
Benefits
- Enhanced durability and protection for the components encapsulated between the substrates.
- Improved control and optimization of the switching device and light-emitting diode.
- Simplified manufacturing process for display panels and lighting panels.
Original Abstract Submitted
The present application provides a substrate encapsulating method, a display panel, and a display device. The substrate encapsulating method includes providing a first underlay, and fabricating a switching device on the first underlay to form a switching substrate; providing a second underlay, and fabricating a light-emitting diode on the second underlay to form a light-emitting substrate; applying a frame glue to an edge of the switching substrate or an edge of the light-emitting substrate; and bonding the switching substrate and the light-emitting substrate with the frame glue to seal the light-emitting diode between the switching substrate and the light-emitting substrate.
