18158514. LED CHIP PACKAGING MODULE, FABRICATION METHOD THEREOF, AND DISPLAY simplified abstract (Huawei Technologies Co., Ltd.)
LED CHIP PACKAGING MODULE, FABRICATION METHOD THEREOF, AND DISPLAY
Organization Name
Inventor(s)
LED CHIP PACKAGING MODULE, FABRICATION METHOD THEREOF, AND DISPLAY - A simplified explanation of the abstract
This abstract first appeared for US patent application 18158514 titled 'LED CHIP PACKAGING MODULE, FABRICATION METHOD THEREOF, AND DISPLAY
Simplified Explanation
The abstract describes an LED chip packaging module that includes a re-distribution layer (RDL), a micro light emitting diode (micro LED) chip, and a micro integrated circuit (micro IC). The RDL has first pads on its lower surface, and the micro LED chip and micro IC are both placed on the upper surface of the RDL. The micro LED chip and micro IC are connected to the RDL through their respective electrodes. The first pad is connected to the micro IC through the RDL, and the micro IC is connected to the micro LED chip through the RDL. The first pad is designed to receive an external drive signal.
- LED chip packaging module with a re-distribution layer (RDL)
- RDL has first pads on its lower surface
- Micro LED chip and micro IC placed on the upper surface of the RDL
- Micro LED chip and micro IC connected to the RDL through their electrodes
- First pad connected to the micro IC through the RDL
- Micro IC connected to the micro LED chip through the RDL
- First pad designed to receive an external drive signal
Potential Applications
- LED lighting systems
- Display panels
- Automotive lighting
- Consumer electronics
Problems Solved
- Simplifies the packaging of LED chips
- Enables efficient electrical connections between the micro LED chip, micro IC, and external drive signal
- Provides a compact and reliable LED chip packaging solution
Benefits
- Improved performance and reliability of LED chip packaging
- Reduced size and weight of LED modules
- Enhanced energy efficiency and lifespan of LED lighting systems
- Cost-effective manufacturing process for LED chip packaging
Original Abstract Submitted
This disclosure provides an LED chip packaging module includes: a re-distribution layer RDL, where a plurality of first pads are disposed on a lower surface of the RDL; a micro light emitting diode micro LED chip disposed on an upper surface of the RDL, where an electrode of the micro LED chip faces the upper surface of the RDL and is connected to the RDL; and a micro integrated circuit micro IC disposed on the upper surface of the RDL, where an electrode of the micro IC faces the upper surface of the RDL and is connected to the RDL. The first pad is electrically connected to the micro IC by using the RDL. The micro IC is electrically connected to the micro LED chip by using the RDL. The first pad is configured to receive an external drive signal.
