Intel corporation (20240103216). VERTICAL THROUGH-SILICON WAVEGUIDE FABRICATION METHOD AND TOPOLOGIES simplified abstract

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VERTICAL THROUGH-SILICON WAVEGUIDE FABRICATION METHOD AND TOPOLOGIES

Organization Name

intel corporation

Inventor(s)

Sagar Suthram of Portland OR (US)

John Heck of Berkeley CA (US)

Ling Liao of Fremont CA (US)

Mengyuan Huang of Cupertino CA (US)

Wilfred Gomes of Portland OR (US)

Pushkar Ranade of San Jose CA (US)

Abhishek Anil Sharma of Portland OR (US)

VERTICAL THROUGH-SILICON WAVEGUIDE FABRICATION METHOD AND TOPOLOGIES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240103216 titled 'VERTICAL THROUGH-SILICON WAVEGUIDE FABRICATION METHOD AND TOPOLOGIES

Simplified Explanation

The abstract of the patent application describes embodiments related to through silicon waveguides and methods of forming such waveguides. In summary, the waveguide comprises a substrate made of silicon, with a waveguide structure provided through the substrate and surrounded by a cladding.

  • Silicon waveguide technology
  • Waveguide structure through silicon substrate
  • Cladding surrounding the waveguide structure

Potential Applications

The technology could be applied in:

  • Optical communication systems
  • Integrated photonics devices
  • Sensing applications

Problems Solved

The technology addresses:

  • Efficient light transmission through silicon
  • Integration of waveguides in silicon-based devices
  • Enhanced optical signal processing capabilities

Benefits

The technology offers:

  • Improved optical signal transmission
  • Compact and integrated photonics solutions
  • Enhanced performance of silicon-based devices

Potential Commercial Applications

The technology could be utilized in:

  • Telecommunications industry
  • Biomedical devices
  • Data centers and computing systems

Possible Prior Art

One possible prior art could be:

  • Existing methods of forming waveguides in silicon substrates

Unanswered Questions

How does this technology compare to traditional optical waveguides?

This technology offers the advantage of integration within silicon-based devices, potentially reducing costs and improving performance.

What are the potential limitations of through silicon waveguides?

One potential limitation could be the complexity of fabrication processes, which may impact scalability and cost-effectiveness.


Original Abstract Submitted

embodiments disclosed herein include through silicon waveguides and methods of forming such waveguides. in an embodiment, a through silicon waveguide comprises a substrate, where the substrate comprises silicon. in an embodiment, a waveguide is provided through the substrate. in an embodiment, the waveguide comprises a waveguide structure. and a cladding around the waveguide structure.