18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy)
Three-Dimensional Chip Comprising Heat Transfer Means
Organization Name
Inventor(s)
Yang Liu of Short Hills NJ (US)
Raffaele Luca Amalfi of New Providence NJ (US)
Ryan Enright of Floral Park NY (US)
Three-Dimensional Chip Comprising Heat Transfer Means - A simplified explanation of the abstract
This abstract first appeared for US patent application 18229700 titled 'Three-Dimensional Chip Comprising Heat Transfer Means
Simplified Explanation
The patent application describes a three-dimensional chip with integrated circuit layers and microfluidic channel layers for passive heat transfer.
- The three-dimensional chip consists of multiple integrated circuit layers stacked together.
- Microfluidic channel layers are positioned between the integrated circuit layers.
- The microfluidic channels allow working fluid to flow through them, providing passive heat transfer for the electronic and/or photonic components in the integrated circuit layers.
- The microfluidic channels have portions that extend along the layer and through the layer.
Potential Applications
- High-performance computing systems
- Data centers
- Medical devices
- Aerospace technology
Problems Solved
- Heat dissipation in densely packed electronic components
- Cooling challenges in three-dimensional chip designs
Benefits
- Improved thermal management
- Enhanced performance and reliability of electronic devices
- Compact design for space-constrained applications
Original Abstract Submitted
Examples of the disclosure relate to a three-dimensional chip. The three-dimensional chip includes a plurality of integrated circuit layers and one or more microfluidic channel layers. The plurality of integrated circuit layers includes one or more electronic and/or photonic components and are arranged in a stack. The one or more microfluidic channel layers are positioned between integrated circuit layers. The microfluidic channel layers include microfluidic channels and the microfluidic channels are configured to enable working fluid to flow through the microfluidic channels to provide passive heat transfer for the one or more electronic and/or photonic components in the integrated circuit layers. The microfluidic channels include one or more portions that extend along a microfluidic channel layer and one or more portions that extend through a microfluidic channel layer.
