Qualcomm incorporated (20240105568). PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS simplified abstract
Contents
- 1 PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS
Organization Name
Inventor(s)
Joan Rey Villarba Buot of Escondido CA (US)
Hong Bok We of San Diego CA (US)
Michelle Yejin Kim of Carlsbad CA (US)
Aniket Patil of San Diego CA (US)
PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105568 titled 'PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS
Simplified Explanation
The patent application describes a package comprising a substrate with multiple dielectric layers and interconnects, along with an integrated device coupled to the substrate.
- The substrate includes a first dielectric layer, a second dielectric layer, and a third dielectric layer.
- The second dielectric layer is positioned between the first and third dielectric layers and is made of a different material.
- The package also contains a plurality of interconnects located within the dielectric layers.
Potential Applications
This technology could be applied in:
- Integrated circuits
- Microelectronics
- Semiconductor devices
Problems Solved
This technology helps address:
- Improved signal transmission
- Enhanced device performance
- Reduced signal interference
Benefits
The benefits of this technology include:
- Higher efficiency in signal transmission
- Increased reliability of integrated devices
- Enhanced overall performance of electronic systems
Potential Commercial Applications
Optimized for SEO: "Innovative Dielectric Layer Package for Semiconductor Devices"
- Consumer electronics
- Telecommunications industry
- Automotive electronics
Possible Prior Art
There may be prior art related to:
- Dielectric layer integration in semiconductor devices
- Interconnect technology in electronic packaging
Unanswered Questions
Question 1:
What specific materials are used in the first and third dielectric layers?
Answer:
The abstract does not provide specific details about the materials used in the first and third dielectric layers.
Question 2:
How does the integration of the second dielectric layer improve device performance?
Answer:
The abstract does not elaborate on the specific mechanisms through which the integration of the second dielectric layer enhances device performance.
Original Abstract Submitted
a package comprising a substrate and an integrated device coupled to the substrate. the substrate includes a first dielectric layer, a second dielectric layer, a third dielectric layer, and a plurality of interconnects located in the first dielectric layer, the second dielectric layer and the third dielectric layer. the second dielectric layer is located between the first dielectric layer and the third dielectric layer. the second dielectric layer includes a different material than the first dielectric layer and the third dielectric layer.
