17460705. PACKAGE STRUCTURES AND METHOD FOR FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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PACKAGE STRUCTURES AND METHOD FOR FORMING THE SAME

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Chin-Hua Wang of New Taipei City (TW)

Shu-Shen Yeh of Taoyuan City (TW)

Po-Chen Lai of Hsinchu county (TW)

Po-Yao Lin of Zhudong Township (TW)

Shin-Puu Jeng of Po-Shan Village (TW)

PACKAGE STRUCTURES AND METHOD FOR FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17460705 titled 'PACKAGE STRUCTURES AND METHOD FOR FORMING THE SAME

Simplified Explanation

The abstract describes a package structure that consists of two components: a first package component and a second package component. The second component includes a substrate and an electronic component mounted on it, while the first component is mounted to the substrate. A ring structure is also included in the package structure, surrounding the first component. The ring structure has two feet that extend towards the substrate, with the electronic component located between them. The first package component is exposed from the ring structure.

  • The package structure includes two components: a first package component and a second package component.
  • The second package component consists of a substrate and an electronic component mounted on it.
  • The first package component is mounted to the substrate.
  • A ring structure is present in the package structure, surrounding the first package component.
  • The ring structure has two feet that extend towards the substrate.
  • The electronic component is covered by the ring structure and located between the two feet.
  • The first package component is exposed from the ring structure.

Potential Applications

  • Electronics packaging
  • Integrated circuits
  • Semiconductor devices

Problems Solved

  • Provides protection and support for the electronic component mounted on the substrate.
  • Ensures proper alignment and positioning of the first package component.
  • Helps in efficient heat dissipation and thermal management.

Benefits

  • Enhanced reliability and durability of the package structure.
  • Improved thermal performance and heat dissipation.
  • Simplified assembly and manufacturing process.
  • Potential for miniaturization and compact design.


Original Abstract Submitted

A package structure is provided. The package structure includes a first package component and a second package component. The second package component includes a substrate and an electronic component disposed on the substrate, and the first package component is mounted to the substrate. The package structure further includes a ring structure disposed on the second package component and around the first package component. The ring structure has a first foot and a second foot, the first foot and the second foot extend toward the substrate, the electronic component is covered by the ring structure and located between the first foot and the second foot, and the first package component is exposed from the ring structure.

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