17932209. DIE PACKAGE WITH SEALED DIE ENCLOSURES simplified abstract (QUALCOMM Incorporated)
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Contents
DIE PACKAGE WITH SEALED DIE ENCLOSURES
Organization Name
Inventor(s)
DIE PACKAGE WITH SEALED DIE ENCLOSURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17932209 titled 'DIE PACKAGE WITH SEALED DIE ENCLOSURES
Simplified Explanation
The patent application describes apparatuses and techniques for creating single or multi-die packages with sealed enclosures.
- Die with perimeter metallization
- Package substrate
- Seal to couple die to package substrate for sealing
Potential Applications
- Electronics packaging
- Semiconductor industry
- Microelectronics
Problems Solved
- Protecting delicate dies
- Ensuring proper sealing
- Preventing contamination
Benefits
- Improved protection for dies
- Enhanced reliability
- Increased longevity of electronic components
Original Abstract Submitted
Disclosed are apparatuses and techniques for fabricating single or multi-die packages with sealed enclosures. In one or more aspects an apparatus includes a die; a perimeter metallization disposed on a perimeter of the die; a package substrate; and a seal coupled to the perimeter metallization and the package substrate, configured to seal the die to the package substrate.
