17943299. LIGHT EMITTING DIODE PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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LIGHT EMITTING DIODE PACKAGE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Jongho Lim of Suwon-si (KR)

Jaehyuk Lim of Hwaseong-si (KR)

Hosik Jun of Hwaseong-si (KR)

Hyojeong Kang of Hwaseong-si (KR)

Yonggi Cho of Suwon-si (KR)

LIGHT EMITTING DIODE PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17943299 titled 'LIGHT EMITTING DIODE PACKAGE

Simplified Explanation

The abstract describes a patent application for a light-emitting diode (LED) package that includes various components such as a substrate, upper pads, a side surface molding layer, an LED chip, a fluorescent layer, and a reflection molding layer.

  • The LED package includes a substrate made of an insulating material.
  • There are upper pads on the upper surface of the substrate.
  • A side surface molding layer covers the upper surface of the substrate and the side surfaces of the upper pads.
  • An LED chip is placed on the upper surface of the substrate and is electrically connected to the upper pads.
  • A fluorescent layer is present on the LED chip.
  • A reflection molding layer, made of white silicon, covers the substrate and the LED chip, exposing a portion of the side surfaces of the fluorescent layer.

Potential Applications:

  • Lighting applications, such as LED bulbs and fixtures.
  • Display applications, such as LED screens and signage.
  • Automotive lighting, including headlights and taillights.
  • Backlighting for LCD screens in televisions, monitors, and mobile devices.

Problems Solved:

  • The LED package provides improved light reflection and emission efficiency.
  • The reflection molding layer helps to enhance the brightness and color rendering of the LED chip.
  • The exposed side surfaces of the fluorescent layer allow for better light diffusion and distribution.

Benefits:

  • Increased overall efficiency and brightness of the LED package.
  • Improved color rendering and light quality.
  • Enhanced light diffusion and distribution.
  • Potential for energy savings and longer lifespan compared to traditional lighting technologies.


Original Abstract Submitted

A light-emitting diode (LED) package includes a substrate including an insulating material; upper pads on an upper surface of the substrate; a side surface molding layer covering the upper surface of the substrate and side surfaces of the upper pads; an LED chip on the upper surface of the substrate and electrically connected to the upper pads; a fluorescent layer on the LED chip; and a reflection molding layer on the substrate and covering the LED chip, the reflection molding layer including white silicon, wherein the reflection molding layer exposes a portion of side surfaces of the fluorescent layer.

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