17897156. MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS simplified abstract (Micron Technology, Inc.)
MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS
Organization Name
Inventor(s)
Kelvin Tan Aik Boo of Singapore (SG)
Chin Hui Chong of Singapore (SG)
MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17897156 titled 'MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS
Simplified Explanation
The abstract describes a system with a main module package and an upper module package, where the upper module package can be mounted on the main module package to enclose an electronic device within a cavity.
- The system includes a main module package with a substrate and an electronic device mounted on one side.
- The upper module package has a substrate with one or more electronic devices mounted on one side and a cavity on the opposite side.
- The upper module package can be mounted on the main module package to enclose the electronic device within the cavity.
Potential Applications
- Electronics manufacturing
- Modular device assembly
- Compact electronic systems
Problems Solved
- Efficient use of space in electronic devices
- Simplified assembly process
- Protection of electronic components
Benefits
- Space-saving design
- Easy assembly and disassembly
- Enhanced protection for electronic devices
Original Abstract Submitted
Modular systems in packages, and associated devices, systems, and methods, are disclosed herein. In one embodiment, a system comprises a main module package and an upper module package. The main module package includes a first substrate and a first electronic device mounted on a first side of the first substrate. The upper module package includes a second substrate and one or more second electronic devices mounted on a first side of the second substrate. The second substrate includes a cavity at a second side of the second substrate opposite the first side, and the upper module package is mountable on the first side of the first substrate of the main module package such that the first electronic device is positioned within the cavity and the second substrate generally surrounds at least a portion of a perimeter of the first electronic device.
