17960151. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Ming-Fa Chen of Taichung City (TW)
Hsien-Wei Chen of Hsinchu City (TW)
Jie Chen of New Taipei City (TW)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17960151 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a semiconductor package that includes a photonic die, an encapsulated electronic die, a substrate, and a lens structure. The photonic die has an optical coupler, and the encapsulated electronic die is bonded to it. The substrate is bonded to the encapsulated electronic die, and the lens structure is placed over the photonic die, overlapping with the optical coupler. The optical coupler is designed to be optically coupled to an optical signal source through the lens structure.
- The semiconductor package includes a photonic die with an optical coupler.
- An encapsulated electronic die is bonded to the photonic die.
- A substrate is bonded to the encapsulated electronic die.
- A lens structure is placed over the photonic die, overlapping with the optical coupler.
- The optical coupler is designed to be optically coupled to an optical signal source through the lens structure.
Potential Applications
- Optical communication systems
- Fiber optic networks
- Data centers
- Telecommunications equipment
Problems Solved
- Efficient optical coupling between the photonic die and the optical signal source
- Protection and encapsulation of the electronic die
- Integration of photonic and electronic components in a single package
Benefits
- Improved performance and reliability of optical communication systems
- Compact and integrated design
- Enhanced protection of electronic components
- Simplified manufacturing process
Original Abstract Submitted
A semiconductor package includes a photonic die, an encapsulated electronic die, a substrate, and a lens structure. The photonic die includes an optical coupler. The encapsulated electronic die is disposed over and bonded to the photonic die. The encapsulated electronic die includes an electronic die and an encapsulating material at least laterally encapsulating the electronic die. The substrate is disposed over and bonded to the encapsulated electronic die. The lens structure is disposed over the photonic die and is overlapped with the optical coupler from a top view. The optical coupler is configured to be optically coupled to an optical signal source through the lens structure.
