17877041. 3D High Bandwidth Memory and Optical Connectivity Stacking simplified abstract (GOOGLE LLC)

3D High Bandwidth Memory and Optical Connectivity Stacking

Organization Name

GOOGLE LLC

Inventor(s)

Horia Alexandru Toma of Sunnyvale CA (US)

Zuowei Shen of Los Altos CA (US)

Yujeong Shim of Cupertino CA (US)

Teckgyu Kang of Saratoga CA (US)

Jaesik Lee of San Jose CA (US)

Georgios Konstadinidis of San Jose CA (US)

Sukalpa Biswas of Fremont CA (US)

Hong Liu of Palo Alto CA (US)

Biao He of Sunnyvale CA (US)

3D High Bandwidth Memory and Optical Connectivity Stacking - A simplified explanation of the abstract

This abstract first appeared for US patent application 17877041 titled '3D High Bandwidth Memory and Optical Connectivity Stacking

Simplified Explanation

The technology described in this patent application relates to the stacking of high bandwidth memory (HBM) dies using optical connectivity. The system allows for compact and high-performance computing by interconnecting HBM dies with an optical interface.

• The patent application describes a method for 3D-stacking of HBM dies with an optical interface, enabling efficient and high-speed data transfer.
• An optical chiplet is placed on top of a stack of HBM dies, with a cooling die positioned between the HBM dies and the optical chiplet.
• The optical chiplet is designed to connect the HBM optics module package to other components of the package using optical fibers.

Potential applications of this technology:

• High-performance computing systems that require fast and efficient data transfer.
• Data centers and server farms that need compact and high-bandwidth memory solutions.
• Artificial intelligence and machine learning applications that rely on large amounts of data processing.

Problems solved by this technology:

• Traditional methods of interconnecting memory dies may result in limited bandwidth and increased power consumption.
• The use of optical connectivity allows for higher bandwidth and lower power consumption, solving these limitations.

Benefits of this technology:

• Compact and efficient memory stacking, enabling high-performance computing in a smaller form factor.
• Faster data transfer rates and lower power consumption compared to traditional interconnect technologies.
• Improved scalability and flexibility in memory configurations, allowing for easier upgrades and customization.

Original Abstract Submitted

The technology generally relates to high bandwidth memory (HBM) and optical connectivity stacking. Disclosed systems and methods herein allow for 3D-stacking of HBM dies that are interconnected with an optical interface in a manner that allows for compact, high-performance computing. An optical chiplet can be configured to be placed onto a stack of HBM dies, with a cooling die that is positioned between the HBM dies and the optical chiplet. The optical chiplet may be configured to connect the HBM optics module package to one or more other components of the package via to one or more optical fibers.