17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
Contents
- 1 HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
Organization Name
Inventor(s)
Kristof Darmawikarta of Chandler AZ (US)
Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)
Sameer Paital of Chandler AZ (US)
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17956384 titled 'HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
Simplified Explanation
The patent application describes an electronic device with a glass core layer and discrete passive electronic components attached using hybrid bonds.
- Glass core layer with first contact pads
- Discrete passive electronic components with second contact pads
- Hybrid bonds between first contact pads and second contact pads
Potential Applications
This technology could be used in various electronic devices such as sensors, medical devices, and communication equipment.
Problems Solved
This technology allows for the integration of passive electronic components onto a glass substrate, providing a more compact and efficient design.
Benefits
- Improved reliability and durability - Enhanced performance due to the use of glass substrate - Cost-effective manufacturing process
Potential Commercial Applications
- "Glass Substrate Electronic Device Technology for Enhanced Performance"
Possible Prior Art
There may be prior art related to the integration of electronic components on glass substrates, but specific examples are not provided in the patent application.
Unanswered Questions
How does the use of glass substrate impact the overall performance of the electronic device?
The patent application mentions the use of a glass core layer, but it does not elaborate on the specific benefits or drawbacks of this material in relation to the device's performance.
What are the specific types of passive electronic components that can be integrated using this technology?
The patent application mentions discrete passive electronic components, but it does not specify the range or types of components that can be effectively integrated using this method.
Original Abstract Submitted
An electronic device includes a substrate including a glass core layer and first contact pads on a first surface of the glass core layer; one or more discrete passive electronic components disposed on the first surface of the glass core layer, the one or more discrete passive electronic components including second contact pads on a bottom surface of the one or more discrete passive electronic components; and hybrid bonds between the first contact pads of the glass core layer and the second contact pads of the one or more discrete passive electronic components.
