17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Myungsam Kang of Hwaseong-si (KR)

Jeongseok Kim of Cheonan-si (KR)

Bongju Cho of Hwaseong-si (KR)

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17702440 titled 'SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE

Simplified Explanation

The abstract describes a semiconductor package that includes multiple layers and structures to improve heat dissipation and connectivity. Here are the key points:

• The semiconductor package consists of a first rewiring layer, a lower semiconductor chip, an upper semiconductor chip, a heat dissipation structure, a molding layer, a second rewiring layer, and one or more connection structures.
• The lower semiconductor chip is placed on the first rewiring layer, and the upper semiconductor chip is placed on top of the lower chip.
• A heat dissipation structure is added on the upper semiconductor chip to enhance heat dissipation.
• The molding layer is applied to the first rewiring layer, making contact with the side surfaces of both semiconductor chips and the heat dissipation structure.
• A second rewiring layer is added on top of the heat dissipation structure.
• Connection structures are positioned on the first rewiring layer, adjacent to the side surfaces of both semiconductor chips. These structures extend through the molding layer and connect the first rewiring layer to the second rewiring layer.
• The upper semiconductor chip and the heat dissipation structure are in direct contact with each other.

Potential applications of this technology:

• Semiconductor packaging for electronic devices such as smartphones, tablets, and computers.
• High-performance computing systems.
• Automotive electronics.
• Internet of Things (IoT) devices.

Problems solved by this technology:

• Improved heat dissipation, which is crucial for preventing overheating and maintaining optimal performance of semiconductor chips.
• Enhanced connectivity between different layers and structures within the semiconductor package.

Benefits of this technology:

• Efficient heat dissipation, leading to improved performance and reliability of electronic devices.
• Enhanced connectivity ensures reliable and efficient data transfer within the semiconductor package.
• Compact design allows for smaller and more lightweight electronic devices.

Original Abstract Submitted

A semiconductor package includes a first rewiring layer; a lower semiconductor chip on the first rewiring layer; an upper semiconductor chip on the lower semiconductor chip; a heat dissipation structure on the upper semiconductor chip; a molding layer on the first rewiring layer so as to contact side surfaces of the lower semiconductor chip, the upper semiconductor chip, and the heat dissipation structure; a second rewiring layer on the heat dissipation structure; and one or more connection structures on the first rewiring layer and positioned adjacent to the side surfaces of the lower semiconductor chip and the upper semiconductor chip and configured to extend through the molding layer and connect the first rewiring layer to the second rewiring layer, wherein the upper semiconductor chip and the heat dissipation structure contact each other.